Abstract: A machine (1) and a method for thermobonding using an emission of electromagnetic waves (13), for example microwaves, to activate one or a plurality of adhesive layers located between a support and one or a plurality of layers of flexible covering, through a bed of particles (4) fluidized by a humidified gas. A multi-layer upholstery item including at least one non-permeable layer and produced in a single operation is also described.

Abstract: A device for the thermal bonding of a flexible covering (13) to a support (12), using a fluidized bed of particles (4), includes an internal zone, called a heating box (10) smaller in size than that of the enclosure (2), which is placed approximately at the center of the latter, the heating box having a gas distributor (6b), a diffusion mesh (7b) and a gas feed system (5b, 9) that are separate and isolated from those of the enclosure, and heating elements (11) designed to be placed in the particle bed. A thermal bonding method suitable for being implemented by this device is also described.

Abstract: A composition of particles referred to as hot-melt, self-adhesive particles (10, 20), is made from a fusible thermoplastic material suitable for sticking parts together and having spikes (21) and/or barbs (11, 22) which can be hooked to the surface of at least one part to be stuck, in particular to the fibers of at least one surface of the parts to be stuck. A sticking method using such a composition is also described.

Abstract: A device for the thermal bonding of a flexible covering (13) to a support (12), using a fluidized bed of particles (4), includes an internal zone, called a heating box (10) smaller in size than that of the enclosure (2), which is placed approximately at the center of the latter, the heating box having a gas distributor (6b), a diffusion mesh (7b) and a gas feed system (5b, 9) that are separate and isolated from those of the enclosure, and heating elements (11) designed to be placed in the particle bed. A thermal bonding method suitable for being implemented by this device is also described.