Patents Assigned to c/o LINTEC CORPORATION
  • Publication number: 20100032088
    Abstract: The present invention relates to a pressure sensitive adhesive sheet 1 comprising a base material 11 and a pressure sensitive adhesive layer 12 wherein a plurality of through holes 2 passing through one face of the pressure sensitive adhesive sheet 1 to the other face are formed. The hole diameter of the through holes 2 is 0.1 to 300 ?m and the hole density is 30 to 50,000/100 cm2. It is preferable to form the through holes 2 using a laser beam machining. According the pressure sensitive adhesive sheet 1, an air trapping or a blister can be prevented or removed without disfiguring the pressure sensitive adhesive sheet and while securing a sufficient adhesive strength.
    Type: Application
    Filed: October 8, 2009
    Publication date: February 11, 2010
    Applicant: c/o LINTEC CORPORATION
    Inventors: Kiichiro Kato, Kazuya Kato, Takashi Takemoto