Patents Assigned to C/O RENESAS ELECTRONICS CORPORATION
  • Publication number: 20110281401
    Abstract: A transparent board is positioned on a support board provided with a positioning mark, and a release material is provided. A semiconductor element is then positioned so that the electrode element faces upward, and the support board is then removed. An insulating resin is then formed on the release material so as to cover the semiconductor element; and a via, a wiring layer, an insulation layer, an external terminal, and a solder resist are then formed. The transparent board is then peeled from the semiconductor device through the use of the release material. A chip can thereby be mounted with high precision, there is no need to provide a positioning mark during mounting of the chip on the substrate in the manufacturing process, and the substrate can easily be removed. As a result, a semiconductor device having high density and a thin profile can be manufactured at low cost.
    Type: Application
    Filed: July 25, 2011
    Publication date: November 17, 2011
    Applicants: C/O RENESAS ELECTRONICS CORPORATION, NEC CORPORATION
    Inventors: Kentaro MORI, Shintaro YAMAMICHI, Hideya MURAI, Takuo FUNAYA, Masaya KAWANO, Takehiko MAEDA, Kouji SOEJIMA