Patents Assigned to C & R Co.
  • Patent number: 7534351
    Abstract: There is provided a reaction system capable of, in the feeding of liquid stored after gas-liquid mixing into waste water to be treated of a reaction tank, conditioning the interior of the reaction tank to a pressurized state so as to simultaneously accomplish enhancement of utilization efficiency of gas phase and further reduction of the amount of excess sludge generated. There is further provided a biological purification process characterized in that microorganisms fulfill purification activity in a pressurized reaction tank having a pressure other than deep water pressure applied thereto. Preferably, together with water to be treated, reactant gas such as pure oxygen, ozone-containing oxygen (ozonized oxygen) or air is fed into the pressurized reaction tank. With respect to gas and liquid fed into the reaction tank, preferably, reactant gas is fed in the form of dissolved gas or microbubbles by means of a gas-liquid mixing unit (line atomizer).
    Type: Grant
    Filed: March 22, 2004
    Date of Patent: May 19, 2009
    Assignees: C & R Co.
    Inventor: Kousuke Chiba
  • Patent number: 7105092
    Abstract: Disclosed is a waste water disposal process in the biosolid method according to a line atomizing treatment in which a reactive gas containing oxygen or oxygen and ozone as hardly soluble gases is dissolved/stored in water as being converted into ultrafine bubbles. The characteristic feature is that, by forming a gas-dispersion liquid in which the reactive gas containing oxygen or oxygen and ozone is dispersed in the form of ultrafine bubbles in returned biosolid water or in clean water at outside of the vessels (pools) of the waste water treatment system and by introducing the aforementioned gas-dispersion liquid into a reaction vessel (aerobic or anaerobic), oxygen is supplied to the microorganisms. Alternatively, the aforementioned gas-dispersion liquid is introduced into a vessel in the step preceding the reaction vessel or succeeding the reaction vessel.
    Type: Grant
    Filed: July 18, 2003
    Date of Patent: September 12, 2006
    Assignees: C & R Co., Kousuke Chiba
    Inventor: Kousuke Chiba
  • Publication number: 20050258094
    Abstract: Disclosed is a waste water disposal process in the biosolid method according to a line atomizing treatment in which a reactive gas containing oxygen or oxygen and ozone as hardly soluble gases is dissolved/stored in water as being converted into ultrafine bubbles. The characteristic feature is that, by forming a gas-dispersion liquid in which the reactive gas containing oxygen or oxygen and ozone is dispersed in the form of ultrafine bubbles in returned biosolid water or in clean water at outside of the vessels (pools) of the waste water treatment system and by introducing the aforementioned gas-dispersion liquid into a reaction vessel (aerobic or anaerobic), oxygen is supplied to the microorganisms. Alternatively, the aforementioned gas-dispersion liquid is introduced into a vessel in the step preceding the reaction vessel or succeeding the reaction vessel.
    Type: Application
    Filed: July 18, 2003
    Publication date: November 24, 2005
    Applicant: C & R Co. and Kousuke Chiba
    Inventor: Kousuke Chiba
  • Patent number: 6597268
    Abstract: An electromagnetic device is provided with a coil bobbin (1) supporting an excitation coil (5) and a U-shaped movable iron piece (2) whose one side (2a) is inserted in and fixed to a hollow section (1a) of the coil bobbin (1) in a state where it is held between a pair of iron cores (3) and (4). A remaining side (2b) of the U-shaped movable iron piece (2) is inserted in a through-hole section (1c) of the coil bobbin (1) and has a resilient characteristic that it is spaced away from the one side (2a). The top surface of each of rising sections (3a) and (3b) of the iron cores (3) and (4) is configured by bending the end of each of the rising sections (3a) and (3b) and is located to be opposite to the top of the remaining side (2b) at a preset distance away.
    Type: Grant
    Filed: March 27, 2001
    Date of Patent: July 22, 2003
    Assignee: Japan A.C.R. Co., Ltd.
    Inventors: Gunchu Iwasaki, Kenta Namioka
  • Patent number: 5508326
    Abstract: An emulsifying epoxy resin composition having excellent emulsifiability and storage stability, which comprises a specific epoxy resin (I), an emulsifiable epoxy compound (II) prepared by reacting an urethane compound (II-1), prepared by the reaction of a polyalkylene polyether polyol compound (II-1-1) having a number average molecular weight of 200 to 12,000 and an ethylene oxide content of 80% by weight or above with an excess amount of a polyisocyanate compound (II-1-2), with a specific epoxy compound (II-2) and an alkylphenol ethoxylate (II-3) having a number average molecular weight of 300 to 5,000 at a specific ratio, and water (III). A curable composition having a high cure rate and the cured product obtained there from having excellent film strength, water resistance and so on, which comprises the above-described emulsifiable epoxy resin composition and an active organic amino compound (IV) is also within the scope of the present invention.
    Type: Grant
    Filed: November 10, 1994
    Date of Patent: April 16, 1996
    Assignees: Asahi Denka Kogyo K.K., A.C.R. Co., Ltd.
    Inventors: Kiyoshi Muto, Hiroshi Suzuki
  • Patent number: 5391596
    Abstract: An emulsifying epoxy resin composition having excellent emulsifiability and storage stability, which comprises a specific epoxy resin (I), an emulsifiable epoxy compound (II) prepared by reacting an urethane compound (II-1), prepared by the reaction of a polyalkylene polyether polyol compound (II-1-1) having a number average molecular weight of 200 to 12,000 and an ethylene oxide content of 80% by weight or above with an excess amount of a polyisocyanate compound (II-1-2), with a specific epoxy compound (II-2) and an alkylphenol ethoxylate (II-3) having a number average molecular weight of 300 to 5,000 at a specific ratio, and water (III). A curable composition having a high cure rate and the cured product obtained these from having excellent film strength, water resistance and so on, which comprises the above-described emulsifiable epoxy resin composition and an active organic amino compound (IV) is also within the scope of the present invention.
    Type: Grant
    Filed: May 13, 1993
    Date of Patent: February 21, 1995
    Assignees: Asahi Denka Kogyo K.K., A.C.R. Co., Ltd.
    Inventors: Kiyoshi Muto, Hiroshi Suzuki
  • Patent number: 5075411
    Abstract: A curable epoxy resin composition comprises (I) an epoxy resin and (II) a curing agent. It may comprise (III) another curing agent. It is preferable for it to comprise 25 to 95 wt.% of (I) and 5 to 45 wt.% of (II).1 an epoxy resin (I) represented by the general formula: ##STR1## wherein Z represents a group selected from among a hydrogen atom, a methyl group and an ethyl group, R represents a group selected from among a hydrogen atom and alkyl groups, and n represents a number of 0 to 1.6, and2 a curing agent comprising a polyamine reaction composition (II) obtained by reacting 1 mol of a phenol (II-1) having at least one unsubstituted reactive site in the aromatic nucleus with at least 1 mol of an aliphatic polyamine (II-2) and at least 1 mol of a carbonyl compound (II-3) having at least one carbonyl group in the molecule.
    Type: Grant
    Filed: February 16, 1990
    Date of Patent: December 24, 1991
    Assignees: Nissan Motor Co., Tsuchiya Mfg. Co., Ltd., Asahi Denka Kogyo K.K., A.C.R. Co., Ltd.
    Inventors: Akio Ogawa, Yukio Ohsaki, Takeichiro Takehara, Tadashi Ashida, Seiichiro Hashimoto
  • Patent number: 4977201
    Abstract: The present invention provides a polyvinyl chloride plastisol composition characterized by containing a specified epoxy resin, a blocked isocyanate and, if necessary, a latent curing agent for an epoxy resin as tackifiers. This plastisol composition is excellent in storage stability and can strongly adhere to various metals and various undercoate of metals (such as electro-deposit) by baking even at a relatively low temperature to give a coating which is free from blowing and exhibits excellent adhesion after the immersion in hot water or the heating. Therefore, the composition is useful as a body sealer or undercoat for an automotive body.
    Type: Grant
    Filed: February 24, 1989
    Date of Patent: December 11, 1990
    Assignees: Asahi Denka Kogyo K.K., A,C,R. Co., Ltd.
    Inventors: Akio Ogawa, Masahiko Shimada, Kazuhiko Ando
  • Patent number: 4736010
    Abstract: An epoxy resin curing composition comprising a novel curing agent which is obtained by the amidation with elimination of alcohol between an adduct of a carboxyl-containing acrylonitrile-butadiene copolymer with an epoxidized fatty acid ester and an amide-forming nitrogenous compound. This composition exhibits improved adhesion involving peel strength to plastics, rubbers or flexible vinyl chloride resins and is excellent in mechanical strength and resistance to water and alkali and particularly to acid.
    Type: Grant
    Filed: April 6, 1987
    Date of Patent: April 5, 1988
    Assignees: Asahi Denka Kogyo K.K., A.C.R. Co., Ltd.
    Inventors: Hiroshi Suzuki, Yutaka Asakawa
  • Patent number: 4689390
    Abstract: A thermosetting epoxy resin composition of one pack type is provided which contains as indispensable constituents (I) an epoxy resin containing more than one adjacent epoxy groups on the average in the molecule and (II) a curing amount or curing-accelerating amount of a compound obtained by reacting (a) a specified amine/epoxy adduct with (b) phenolic resin(s) and/or polyhydric phenol compound(s) in a weight ratio of (a) to (b) of 1/0.1 to 1/0.8. The composition of the present invention has excellent storage stability and it is curable at a relatively low temperature to form a cured product having excellent mechanical strength, adhesiveness and water resistance.
    Type: Grant
    Filed: March 14, 1986
    Date of Patent: August 25, 1987
    Assignees: Asahi Denka Kogyo K.K., A.C.R. Co., Ltd.
    Inventors: Hiroshi Suzuki, Yutaka Asakawa, Akira Matsui