Patents Assigned to C. Uyemura & Co., Ltd.
  • Patent number: 10975475
    Abstract: The present invention provides an electroless gold plating bath having excellent plating bath stability without containing a cyanide compound under long term plating bath heating time. An electroless gold plating bath of the present invention solving above problems includes: a water-soluble gold salt; a reducing agent; and a phosphine compound represented by a following formula (1) wherein R1, R2, and R3 represent identically or differently either a phenyl group, or an alkyl group having 1 to 5 carbons, and at least one of the phenyl group or the alkyl group is substituted by a sulfonate group or its salt, a cyano group, or a carboxy group or its salt.
    Type: Grant
    Filed: March 2, 2020
    Date of Patent: April 13, 2021
    Assignee: C. UYEMURA & CO., LTD.
    Inventors: Yohei Kaneko, Naoshi Nishimura, Tsuyoshi Maeda, Katsuhisa Tanabe
  • Patent number: 10947623
    Abstract: An object of the present invention is to provide an electroless plating bath having excellent property in plating film deposition without containing halides such as chloride in the electroless plating bath. A halogen-free electroless plating bath of the present invention comprising: a water soluble platinum compound or a water soluble palladium compound, and a reducing agent wherein the water soluble platinum compound is a tetraammine platinum (II) complex salt excluding a halide of the tetraammine platinum (II) complex salt, the water soluble palladium compound is a tetraammine palladium (II) complex salt excluding a halide of the tetraammine palladium (II) complex salt and tetraammine palladium (II) sulfate, the reducing agent is formic acid or its salts, and the electroless plating bath contains no halide as an additive.
    Type: Grant
    Filed: November 20, 2019
    Date of Patent: March 16, 2021
    Assignee: C. UYEMURA & CO., LTD.
    Inventors: Takuma Maekawa, Toshiaki Shibata, Yukinori Oda
  • Patent number: 10941493
    Abstract: A film formation method is provided with a catalyst film formation step for forming a catalyst film on the surface of a substrate by displacement reduction plating, an intermediate film formation step for forming a palladium plating film on the catalyst film, and a surface film formation step for forming a gold plating film on the palladium plating film.
    Type: Grant
    Filed: April 27, 2017
    Date of Patent: March 9, 2021
    Assignee: C. Uyemura & Co., Ltd.
    Inventors: Katsuhisa Tanabe, Tatsushi Someya, Naoshi Nishimura, Tetsuya Sasamura, Eriko Furuya
  • Publication number: 20210054508
    Abstract: An electroless palladium plating liquid containing at least hydrazine or a salt thereof as a reducing agent, which has excellent bath stability in the vicinity of acidity to neutrality range, long-term stability, and is capable of suppressing the Pd film deposition rate decrease caused by elution of etching resist. An electroless palladium plating solution of the invention includes a palladium compound, hydrazine or its salt, at least one selected from a group consisting of a compound represented by the following formula (1) or its salt and a compound represented by the following formula (2) or its salt; and a pH of 8 or less, NH2NHCOR1 (1), (NH2NHCO)2(R2)n (2), wherein R1 represents H, NH2, an alkyl group having 1 to 10 carbon atoms, an alkoxy group having 1 to 10 carbon atoms, NHNH2, or an aromatic group, wherein each of these groups may have a substituent; R2 represents (CH2) or an aromatic group, wherein each of these groups may have a substituent; and n represents an integer of 0 to 10.
    Type: Application
    Filed: February 15, 2019
    Publication date: February 25, 2021
    Applicant: C. Uyemura & Co., Ltd.
    Inventors: Tetsuya SASAMURA, Tatsushi SOMEYA, Katsuhisa TANABE, Shinsuke WADA, Eriko FURUYA
  • Patent number: 10927463
    Abstract: A novel pretreating liquid for electroless plating which is used simultaneously with reduction treatment after roughening treatment of a filler-containing insulating resin substrate. A pretreating liquid for electroless plating is used simultaneously with reduction treatment when an insulating resin substrate containing a filler is roughened and residues generated on the insulating resin substrate are reduced. The pretreating liquid comprises: a reducing agent; and at least one selected from the group consisting of ethylene-based glycol ether represented by CmH(2m+1)-(OC2H4)n-OH (m=an integer of 1 to 4, n=an integer of 1 to 4) and propylene-based glycol ether represented by CxH(2x+1)-(OC3H6)y-OH (x=an integer of 1 to 4, y= an integer of 1 to 3).
    Type: Grant
    Filed: June 19, 2017
    Date of Patent: February 23, 2021
    Assignee: C. UYEMURA & CO., LTD.
    Inventors: Yoshikazu Saijo, Hisamitsu Yamamoto, Nobuhiko Naka
  • Publication number: 20210047734
    Abstract: A novel pretreating liquid for electroless plating which is used simultaneously with reduction treatment after roughening treatment of a filler-containing insulating resin substrate. A pretreating liquid for electroless plating is used simultaneously with reduction treatment when an insulating resin substrate containing a filler is roughened and residues generated on the insulating resin substrate are reduced. The pretreating liquid contains a reducing agent; and at least one selected from the group consisting of ethylene-based glycol ether represented by CmH(2m+1)-(OC2H4)n-OH (m=an integer of 1 to 4, n=an integer of 1 to 4) and propylene-based glycol ether represented by CxH(2x+1)-(OC3H6)y-OH (x=an integer of 1 to 4, y=an integer of 1 to 3).
    Type: Application
    Filed: November 4, 2020
    Publication date: February 18, 2021
    Applicant: C. Uyemura & Co., Ltd.
    Inventors: Yoshikazu SAIJO, Hisamitsu YAMAMOTO, Nobuhiko NAKA
  • Publication number: 20210032756
    Abstract: A shaft member of an embodiment includes: a base material having a shaft shape and made of steel; a low phosphorus plating layer that is laminated on the base material, that includes phosphorus, and in which the phosphorus content is 4.5 mass % or less; and a base plating layer that is formed as an electrolytic nickel phosphorus plating layer or a high phosphorus plating layer laminated between the base material and the low phosphorus plating layer. It is thus possible to increase the strength of the shaft member and decrease the size of the shaft member.
    Type: Application
    Filed: December 27, 2018
    Publication date: February 4, 2021
    Applicants: AISIN AW CO., LTD., C. Uyemura & Co., Ltd.
    Inventors: Akihiko KITA, Seiya OZAWA, Takahiro MORI, Shoji IGUCHI, Osamu MATSUMOTO
  • Publication number: 20200378008
    Abstract: A present invention provides a method for manufacturing a printed wiring board having excellent plating adhesion to a resin substrate having low surface roughness such as having surface roughness Ra of 0.2 ?m or less, having excellent treating solution stability, and having high penetrability into the resin substrate. The method for manufacturing a resin substrate includes a step 1A or a step 1B; and a step 2 after the step 1A or the step 1B; and the steps are conducted before conducting electroless plating.
    Type: Application
    Filed: May 22, 2020
    Publication date: December 3, 2020
    Applicant: C. Uyemura & Co., Ltd.
    Inventors: Yoshikazu SAIJO, Hisamitsu YAMAMOTO, Nobuhiko NAKA
  • Patent number: 10822704
    Abstract: An electroless platinum plating solution includes a soluble platinum compound, a complexing agent, a reducing agent, and a halide ion supplying agent, the reducing agent being formic acid.
    Type: Grant
    Filed: April 27, 2017
    Date of Patent: November 3, 2020
    Assignee: C. Uyemura & Co., Ltd.
    Inventors: Tetsuya Sasamura, Katsuhisa Tanabe, Hiroki Okubo, Tatsushi Someya, Eriko Furuya
  • Publication number: 20200318239
    Abstract: An object of the present invention is to provide an electroless Pd plating solution which enables formation of a Pd plating film forming a plating film having excellent wire bondability even after a high-temperature thermal history. An electroless Pd plating solution of the present invention includes: a Palladium compound, a reducing agent, a complexing agent, and at least one selected from a group consisting of Ge and rare earth element.
    Type: Application
    Filed: October 3, 2018
    Publication date: October 8, 2020
    Applicant: C. Uyemura & Co., Ltd.
    Inventors: Tsuyoshi MAEDA, Katsuhisa TANABE, Tomohiro KAWAHARA
  • Patent number: 10773280
    Abstract: An ultrasonic treatment apparatus including: an ultrasonic bath for performing an ultrasonic treatment on a treatment target object; a first ultrasonic vibrator provided on the front surface side of the treatment target object; and a second ultrasonic vibrator provided on the back surface side of the treatment target object; wherein the first ultrasonic vibrator does not face the second ultrasonic vibrator.
    Type: Grant
    Filed: November 1, 2017
    Date of Patent: September 15, 2020
    Assignee: C. UYEMURA & CO., LTD.
    Inventors: Hisamitsu Yamamoto, Masayuki Utsumi, Yoshikazu Saijo, Tomoji Okuda, Yutaka Nishinaka, Yoshinori Nakanishi
  • Publication number: 20200283906
    Abstract: The present invention provides an electroless gold plating bath having excellent plating bath stability without containing a cyanide compound under long term plating bath heating time. An electroless gold plating bath of the present invention solving above problems includes: a water-soluble gold salt; a reducing agent; and a phosphine compound represented by a following formula (1) wherein R1, R2, and R3 represent identically or differently either a phenyl group, or an alkyl group having 1 to 5 carbons, and at least one of the phenyl group or the alkyl group is substituted by a sulfonate group or its salt, a cyano group, or a carboxy group or its salt.
    Type: Application
    Filed: March 2, 2020
    Publication date: September 10, 2020
    Applicant: C. Uyemura & Co., Ltd.
    Inventors: Yohei KANEKO, Naoshi NISHIMURA, Tsuyoshi MAEDA, Katsuhisa TANABE
  • Patent number: 10763204
    Abstract: A semiconductor device includes: a semiconductor element; a support as a metallic member that includes a metallized layer having a first component as an iron group element and a second component as a periodic table group five or group six transition metal element other than chromium provided at an outermost surface of the support, and is arranged such that the outermost surface faces the semiconductor element; a joint material that is arranged between the outermost surface of the support and the semiconductor element, and is joined with the outermost surface to fix the semiconductor element to the support; and a molding resin that is arranged to cover a joint body having the support, the joint material and the semiconductor element.
    Type: Grant
    Filed: February 25, 2019
    Date of Patent: September 1, 2020
    Assignees: DENSO CORPORATION, C. Uyemura & Co., Ltd.
    Inventors: Tomohito Iwashige, Kazuhiko Sugiura, Kazuhiro Miwa, Yuichi Sakuma, Seigo Kurosaka, Yukinori Oda
  • Publication number: 20200248312
    Abstract: An object of the present invention is to provide an electroless Pd plating solution which enables formation of a Pd plating film forming a plating film having excellent wire bondability even after a high-temperature thermal history. An electroless Pd plating solution of the present invention solved above problems, the solution includes a Palladium compound, at least one selected from a group consisting of a hypophosphorous acid compound and a phosphorous acid compound, at least one selected from the group consisting of an amine borane compound and a hydroboron compound, and a complexing agent.
    Type: Application
    Filed: October 3, 2018
    Publication date: August 6, 2020
    Applicant: C. Uyemura & Co., Ltd.
    Inventors: Tsuyoshi MAEDA, Katsuhisa TANABE, Shinsuke WADA
  • Publication number: 20200173030
    Abstract: An object of the present invention is to provide an electroless plating bath having excellent property in plating film deposition without containing halides such as chloride in the electroless plating bath.
    Type: Application
    Filed: November 20, 2019
    Publication date: June 4, 2020
    Applicant: C. Uyemura & Co., Ltd.
    Inventors: Takuma MAEKAWA, Toshiaki SHIBATA, Yukinori ODA
  • Patent number: 10669643
    Abstract: A clamper includes: a first clamping member having a first base portion and a first contact portion that is to be in contact with one surface of the workpiece; a second clamping member having a second contact portion that is to be in contact with the other surface of the workpiece; and a clamping member biasing member configured to bias at least one of the first clamping member and the second clamping member in a direction of bringing the first contact portion and the second contact portion closer to each other. The first contact portion has a plurality of plate spring portions extending from the first base portion, the plurality of plate spring portions configured to elastically deform independently from each other to come into contact with the workpiece.
    Type: Grant
    Filed: September 22, 2017
    Date of Patent: June 2, 2020
    Assignee: C. Uyemura & Co., Ltd.
    Inventors: Tetsuro Uemura, Kouhei Kohama, Kazuya Miyoshi, Kahyeong Teoh
  • Patent number: 10576492
    Abstract: A surface treating apparatus that suppresses occurrence of defects is provided. A treatment solution is accumulated in a tank 15 through a treatment solution collecting port/air discharging port 13 in a lower portion of a body 4. An air heated by the treatment solution flows toward an upper portion (portion without the treatment solution) of the tank 15 via the treatment solution collecting port/air discharging port 13 in the lower portion of the body 4, and is discharged via an exhaust duct 17. In this way, the air that is heated and tends to flow upward in the body 4 is discharged from the lower portion thereof and is replaced with an external air from the upper portion thereof. Accordingly, the air in the body 4 can be maintained at a uniform temperature. Thus, the treatment solution that reaches a lower portion of a substrate 54 from an upper portion thereof can be maintained at a uniform temperature.
    Type: Grant
    Filed: October 6, 2017
    Date of Patent: March 3, 2020
    Assignee: C. UYEMURA & CO., LTD.
    Inventors: Masayuki Utsumi, Masahito Tanigawa
  • Publication number: 20200020660
    Abstract: The present invention provides a bump that can prevent diffusion of a metal used as a base conductive layer of the bump into a surface of an Au layer or an Ag layer. A conductive bump of the present invention is a conductive bump formed on a substrate. The conductive bump comprises, at least in order from the substrate: a base conductive layer; a Pd layer; a Pt layer; and an Au layer or an Ag layer having directly contact with the Pd layer, wherein a diameter of the conductive bump is 20 ?m or less.
    Type: Application
    Filed: July 5, 2019
    Publication date: January 16, 2020
    Applicant: C. Uyemura & Co., Ltd.
    Inventors: Takuma MAEKAWA, Yukinori ODA, Toshiaki SHIBATA, Yoshito II, Sho KANZAKI
  • Patent number: 10513779
    Abstract: To provide surface treatment that can reduce occurrence of defects caused by incorporation of dust. Rollers 40 are rotatably fixed to rotating shafts 72 provided to protrude from lateral protective walls 49. The lateral protective walls 49 are fixed perpendicularly to lower protective walls 47 fixed to outer walls 39. Hanging plates 64 of a hanger 50 extend through a space 43 between both lower protective walls 47 and support clips 52. A liquid 41, such as water, is filled in spaces defined by the lateral protective walls 49, the lower protective walls 47, and the outer walls 39. The liquid 41 is filled to cover about half of each rotating shaft 72. Thus, fine dust generated by a transferring mechanism is captured by the liquid 41 and prevented from drifting from the space 34 toward the substrate 54.
    Type: Grant
    Filed: September 6, 2017
    Date of Patent: December 24, 2019
    Assignee: C. UYEMURA & CO., LTD.
    Inventors: Masayuki Utsumi, Nobuhiko Naka
  • Patent number: 10477695
    Abstract: A drying apparatus of the present invention includes a drying tank for performing drying processing of a workpiece, a fixture for the workpiece, heating means opposed to a front surface of the workpiece, and heating means opposed to a back surface of the workpiece, wherein each heating means is inclined from a horizontal line in its longitudinal direction.
    Type: Grant
    Filed: October 17, 2017
    Date of Patent: November 12, 2019
    Assignee: C. UYEMURA & CO., LTD.
    Inventors: Masayuki Utsumi, Tomoji Okuda, Yutaka Nishinaka, Daisuke Matsuyama