Patents Assigned to C. Uyemura & Company, Ltd.
  • Patent number: 5185216
    Abstract: Disclosed is a composite plating film for sliding members, essentially containing at least one of the alloy elements selected from tin, indium, antimony, and copper; inorganic particles; and lead; the composition of the composite plating film being:a) at least one of the alloy elements selected from tin, indium, antimony, and copper . . . 2 to 30 weight % in total;b) inorganic particles . . . 0.3 to 25 volume %; andc) lead . . . the balance.
    Type: Grant
    Filed: August 29, 1990
    Date of Patent: February 9, 1993
    Assignees: Daido Metal Company Ltd., C. Uyemura & Company, Ltd.
    Inventors: Tadashi Tanaka, Masaaki Sakamoto, Motomu Wada, Hideo Ishikawa, Sowjun Matsumura, Tadashi Chiba, Kiyoshi Asakawa, Syoichi Oohora