Abstract: Disclosed is a composite plating film for sliding members, essentially containing at least one of the alloy elements selected from tin, indium, antimony, and copper; inorganic particles; and lead; the composition of the composite plating film being:a) at least one of the alloy elements selected from tin, indium, antimony, and copper . . . 2 to 30 weight % in total;b) inorganic particles . . . 0.3 to 25 volume %; andc) lead . . . the balance.
Type:
Grant
Filed:
August 29, 1990
Date of Patent:
February 9, 1993
Assignees:
Daido Metal Company Ltd., C. Uyemura & Company, Ltd.