Patents Assigned to C2C Technologie fur Leiterplatten GmbH
  • Separator plate for manufacturing printed circuit board components
    Patent number: 7097915
    Abstract: A separator plate for the production of printed circuit board components by pressing individual layers, which separator plate includes a metallic core layer and a coating on at least one side of the core layer, wherein the coating on the core layer, which is made of a comparatively well heat-conductive metal, is comprised of an outer metal layer applied to the core layer by cold-plating and made of a metal having a comparatively high surface hardness.
    Type: Grant
    Filed: July 25, 2003
    Date of Patent: August 29, 2006
    Assignee: C2C Technologie fur Leiterplatten GmbH
    Inventor: Ernst D Backhau
  • Separator plate for manufacturing printed circuit board components
    Publication number: 20040151941
    Abstract: A separator plate for the production of printed circuit board components by pressing individual layers, which separator plate includes a metallic core layer and a coating on at least one side of the core layer, wherein the coating on the core layer, which is made of a comparatively well heat-conductive metal, is comprised of an outer metal layer applied to the core layer by cold-plating and made of a metal having a comparatively high surface hardness.
    Type: Application
    Filed: July 25, 2003
    Publication date: August 5, 2004
    Applicant: C2C TECHNOLOGIE FUR LEITERPLATTEN GMBH
    Inventor: Ernst D. Backhaus