Patents Assigned to C3 CO., LTD.
  • Patent number: 10323884
    Abstract: A heat exchanger according to the present invention comprises: a plate-shaped body having an interior space in which a working fluid is vaporized or condensed and flows; and a wick located within the body, the wick comprising a plurality of needle-shaped particles between which the working fluid flows. By forming a wick comprising needle-shaped particles, the heat exchanger according to the embodiments of the present invention can improve the porosity of the wick compared to conventional groove or mesh-shaped or sintered wicks. Accordingly, the working fluid is capable of flowing inside the wick more smoothly than in the conventional wicks, thereby improving a heat exchange rate or heat exchange performance.
    Type: Grant
    Filed: July 31, 2014
    Date of Patent: June 18, 2019
    Assignees: LG ELECTRONICS INC., C3 CO., LTD.
    Inventors: Youngjoo Yee, Kyungkyoo Chang, Heeseok Jung, Chungguk Lee
  • Publication number: 20160209123
    Abstract: A heat exchanger according to the present invention comprises: a plate-shaped body having an interior space in which a working fluid is vaporized or condensed and flows; and a wick located within the body, the wick comprising a plurality of needle-shaped particles between which the working fluid flows. By forming a wick comprising needle-shaped particles, the heat exchanger according to the embodiments of the present invention can improve the porosity of the wick compared to conventional groove or mesh-shaped or sintered wicks. Accordingly, the working fluid is capable of flowing inside the wick more smoothly than in the conventional wicks, thereby improving a heat exchange rate or heat exchange performance.
    Type: Application
    Filed: July 31, 2014
    Publication date: July 21, 2016
    Applicants: LG ELECTRONICS INC., C3 CO., LTD.
    Inventors: Youngjoo YEE, Kyungkyoo CHANG, Heeseok JUNG, Chungguk LEE