Patents Assigned to Cabot Microelectroncs Corporation
  • Boron-containing polishing system and method
    Publication number: 20030077985
    Abstract: The invention provides a chemical-mechanical polishing system comprising an abrasive, a carrier, and either boric acid, or a conjugate base thereof, wherein the boric acid and conjugate base are not present together in the polishing system in a sufficient amount to act as a pH buffer, or a water-soluble boron-containing compound, or salt thereof, that is not boric acid, and a method of polishing a substrate using the chemical-mechanical polishing system.
    Type: Application
    Filed: October 24, 2001
    Publication date: April 24, 2003
    Applicant: Cabot Microelectroncs Corporation
    Inventors: Renjie Zhou, Steven K. Grumbine, Isaac K. Cherian