Patents Assigned to Cabot Miroelectronics Corporation
  • WET-PROCESS CERIA COMPOSITIONS FOR POLISHING SUBSTRATES, AND METHODS RELATED THERETO
    Publication number: 20150104939
    Abstract: Disclosed are a chemical-mechanical polishing composition and a method of polishing a substrate. The polishing composition comprises low average particle size (e.g., 30 nm or less) wet-process ceria abrasive particles, at least one alcohol amine, and water, wherein said polishing composition has a pH of about 6. The polishing composition can be used, e.g., to polish any suitable substrate, such as a polysilicon wafer used in the semiconductor industry.
    Type: Application
    Filed: October 10, 2013
    Publication date: April 16, 2015
    Applicant: Cabot Miroelectronics Corporation
    Inventors: Brian REISS, Jeffrey Dysard, Sairam Shekhar