Abstract: A multifaceted package is disclosed that permits VLSI and VHSIC integrated circuits in the form of integrated circuit die or chip carries to be mounted on the faces of the package to form a high-density circuit package. The package comprises a plurality of ceramic layers which are cofired and fused together to form a monolithic body having a plurality of planar faces. The body may have a cubic, pyramidal, pentagonal, or other solid geometric form and may have integrated circuit elements disposed on one or more faces of the body. Integrated circuit die or dies discrete electrical components such as chip carriers, resistors, etc. may be mounted to faces of the body and a lid may be provided for hermetic encapsulation of integrated circuit die between lids and respective faces of the body.