Patents Assigned to Calitech Co., Ltd.
  • Wafer protection method
    Patent number: 6673634
    Abstract: The present invention discloses a method and a system of wafer protection of a chemical mechanical process. It takes an image on the polishing pad, and analyzes and identifies the image. If the wafer is out of a polishing head, a signal will be sent to the chemical mechanical polishing station to respond adequately. Otherwise, repeats the image obtaining and its following analysis and identification. The present invention can avoid broken wafers and reduce the station recovery time. Hence, it can increase the up time and the throughput of the station.
    Type: Grant
    Filed: June 17, 2002
    Date of Patent: January 6, 2004
    Assignee: Calitech Co., Ltd.
    Inventor: Chin-Ting Kuo
  • WAFER PROTECTION METHOD
    Publication number: 20030121890
    Abstract: The present invention discloses a method and a system of wafer protection of a chemical mechanical process. It takes an image on the polishing pad, and analyzes and identifies the image. If the wafer is out of a polishing head, a signal will be sent to the chemical mechanical polishing station to respond adequately. Otherwise, repeats the image obtaining and its following analysis and identification. The present invention can avoid broken wafers and reduce the station recovery time. Hence, it can increase the up time and the throughput of the station.
    Type: Application
    Filed: June 17, 2002
    Publication date: July 3, 2003
    Applicant: CALITECH CO., LTD.
    Inventor: Chin-Ting Kuo