Abstract: The present invention relates to a pad to be applied to an inner surface of a finger-ring, comprising an elastically compressible pad body and an adhesive layer adapted to adhere to the inner surface of the finger-ring, wherein, upon the finger-ring being worn upon a finger, the pad body is compressed, and the compressed pad body urges against the finger, such that rotation or movement of the finger-ring about or along the finger is inhibited. The present invention further relates to a method of use thereof, a method of formation thereof and a kit comprising an embodiment of the pad of the present invention.

Abstract: The present invention relates to a pad to be applied to an inner surface of a finger-ring, comprising an elastically compressible pad body and an adhesive layer adapted to adhere to the inner surface of the finger-ring, wherein, upon the finger-ring being worn upon a finger, the pad body is compressed, and the compressed pad body urges against the finger, such that rotation or movement of the finger-ring about or along the finger is inhibited. The present invention further relates to a method of use thereof, a method of formation thereof and a kit comprising an embodiment of the pad of the present invention.