Abstract: A lead saddle assembly is disclosed which includes a plurality of insulated wire leads maintained in a spaced, side-by-side array. The assembly includes a lead saddle comprising first and second tape strips disposed on opposite sides of the array. The tape strips include heat-activatable adhesive so that during fabrication the application of heat to a pre-assembly of the wire leads and tape strips adhere the tape strip to each other and to the wire leads as the leads are held in their array. An apparatus and method for forming lead saddle assemblies as described are also disclosed.