Abstract: A smart-card chip arrangement comprises: a smart-card chip (148); an organic semiconductor layer (166, 168, 170, 172) disposed on a surface of the chip, and at least one transistor (150, 152, 154, 156) formed in the organic semiconductor layer. The at least one transistor is configured so as to enable an invasive attack on the chip to be detected.
Type:
Application
Filed:
September 8, 2008
Publication date:
March 12, 2009
Applicants:
SEIKO EPSON CORPORATION, CAMBRIDGE ENTERPRISE LTD THE OLD SCHOOLS, TRINITY LAND
Inventors:
Philip C. PAUL, Simon TAM, Simon W. MOORE