Abstract: A power semiconductor package structure, base plate, power semiconductor chip, PCB plate, package sealing layer. Upper conductive metal layer of base plate includes left metal layer and right metal layer separated by slot and electrically isolated. Sunken left mounting platform disposed on side of left metal layer close to separation slot. A sunken right mounting platform is disposed in middle part of right metal layer. Right mounting platform is configured for disposing chip, PCB plate is mounted on left and right mounting platform. A drain of chip is interconnected with right mounting platform; left metal layer is connected to source of chip through PCB plate, an extension part configured to connect to external driver circuit of power semiconductor package structure is disposed on an edge of PCB plate on a side of right metal layer, the extension part connects gate and source of chip to external driver circuit.

Abstract: A power module packaging structure based on liquid metal, including an upper printed circuit board or an upper cermet substrate, a power semiconductor chip and a lower cermet substrate, wherein a lower surface copper layer of the circuit board is connected with the chip through a soldering layer, a groove is formed in an upper copper layer of the lower cermet substrate through etching, the surface of the upper copper layer of the lower cermet substrate is subjected to silver plating, liquid metal is filled in the groove, and the chip is embedded into the liquid metal to realize electrical connection between the upper surface of the lower cermet substrate and the lower surface of the chip; an insulating sealing ring is arranged on the circuit board around the chip; and the liquid metal absorbs the lower cermet substrate and the upper printed circuit board together through surface tension.

Abstract: A power semiconductor integrated unit including a substrate with a recess to accommodate a power semiconductor chip, and top surfaces of a source lower-surface pad and a gate pad that are on the same side surface of the power semiconductor chip are or nearly flush with a top surface of a base plate. A flexible printed circuit board connects to the substrate and power semiconductor chip, the flexible printed circuit board has source and gate conductive traces, the source conductive trace connects to the source lower-surface pad on a top side of the chip, and the gate conductive trace connects to the gate pad on the top side of the chip. The flexible printed circuit board has an epitaxial portion, and the gate conductive trace and the source conductive trace extend onto the epitaxial portion. The integrated unit also includes a power converter circuit structure and a parallel loop structure.