Abstract: A apparatus and method is described for the magnetron sputtering of a workpiece to deposit a thin metallic film. A rotating magnetic field is provided in the vicinity of the workpiece to produce higher yield from a given cathode target.
Type:
Grant
Filed:
November 17, 1983
Date of Patent:
February 12, 1985
Assignee:
Canadian Patents and Development Limited-Societe Candienne des Brevets et D'Exploitation (Limitee