Abstract: The present invention discloses a multi-cavity optical sensing and thermopile infrared sensing system, which comprises an optical sensing part, a dielectric layer, a plurality of optical cavities, and a plurality of thermocouples. The dielectric layer covers on the top of the optical sensing part. The optical cavities are formed by a plurality of metal reflectors inside the dielectric layer. The thermocouples are laterally disposed near the bottom of the dielectric layer. In addition, a low temperature region is formed in an area which is the overlapping of vertical projections of such thermocouples and the optical sensing part; a high temperature region is formed by the overlapping of vertical projections of such thermocouples, but without the overlaying which belongs to the vertical projection of the optical sensing part. Therefore, the system can sense the ambient light brightness, color conditions and human blackbody infrared signals within the range of 8-12 micrometers wavelength.

Abstract: The present invention discloses a multi-cavity optical sensing and thermopile infrared sensing system, which comprises an optical sensing part, a dielectric layer, a plurality of optical cavities, and a plurality of thermocouples. The dielectric layer covers on the top of the optical sensing part. The optical cavities are formed by a plurality of metal reflectors inside the dielectric layer. The thermocouples are laterally disposed near the bottom of the dielectric layer. In addition, a low temperature region is formed in an area which is the overlapping of vertical projections of such thermocouples and the optical sensing part; a high temperature region is formed by the overlapping of vertical projections of such thermocouples, but without the overlaying which belongs to the vertical projection of the optical sensing part. Therefore, the system can sense the ambient light brightness, color conditions and human blackbody infrared signals within the range of 8-12 micrometers wavelength.

Abstract: A light source of testing a sensor, a test apparatus and a method are disclosed. The test apparatus includes a light source, a photo-mask and a sensor bearing area. The light source includes a plurality of light emitting diodes with parallel connection for emitting a test light. The light source is disposed in a photo-mask. The photo-mask has a diffuser interface. The test light is then diffused to the outside of the photo-mask through the diffuser interface. The sensor bearing area is for bearing the sensor. The sensor bearing area is disposed at the outside of the photo-mask and locates at a position to enable the test light to reach. Therefore, the test light emitted by the light source is used to test the sensor.

Abstract: Packages for an optical integrated circuit die and a method for making such packages are disclosed. The package includes a die, a die pad, a plurality of lead fingers, and an encapsulating dielectric material. The downward second pad surface of the die pad bearing an integrated circuit is encapsulated by a bottom encapsulating dielectric material. The top encapsulating dielectric material provides the function for protecting the leadframe from severe environment. The top encapsulating dielectric material can be neglected if there is no threat on the integrated circuit die and the leadframe. Multiple of lead fingers are mounted on the printed circuit board. A portion of the printed circuit board is removed in order to provide an optical path for the light beam transmitted from a light source through the transparent bottom encapsulating dielectric material into the integrated circuit die. The method of making a package includes forming a leadframe including a die pad and a plurality of lead fingers.

Abstract: The ambient light sensor structure includes a power supply, a converter, and a pulse processing unit. The power supply provides a reference voltage interface, a high voltage interface and a low voltage interface. The converter includes a first current-to-pulse converter, a second current-to-pulse converter, a first light sensor and a second light sensor. The pulse processing unit comprises a signal subtraction component for circuit blocking, a counter, a digital-to-analog converter and a buffer by series connection. Without incident light, two light sensors would produce a dark current due to the material characteristics of the two photo diodes. Therefore, two current to pulse converters convert the dark current into a pulse signal and transmit the pulse signal to the signal subtraction component in order to cancel the dark current. By the method mentioned above, the dark current caused by the material characteristic of the two light sensors can be eliminated.