Abstract: A multi-point electrical probe for testing location-specific electrical properties on circuit boards. Four generally parallel, electrically conducting probe arms are produced preferably by wafer-based techniques, although any even number of probe arms between two and 64 may be used. The precision of wafer-based manufacturing techniques permits miniaturization beyond that which is conventionally obtained by assembling discrete components. The probe arms are generally flexible, and may be shaped suitably to accommodate a particular circuit geometry. The probe and/or the sample under test may be precisely located by suitable translation and/or rotation stages, which may optionally be placed under computer control. A suitable wiring diagram is provided, and preferable manufacturing techniques are discussed.

Abstract: An object of the present invention is to provide a novel testing probe allowing the testing of electronic circuits of a smaller dimension as compared to the prior art testing technique.