Abstract: Single-layer CNT composites and multilayered or multitiered structures formed therefrom, by stacking of vertically aligned carbon nanotube (CNT) arrays, and methods of making and using thereof are described herein. Such multilayered or multitiered structures can be used as thermal interface materials (TIMs) for a variety of applications, such as burn-in testing.
Abstract: Multilayered or multitiered structures formed by stacking of vertically aligned carbon nanotube (CNT) arrays and methods of making and using thereof are described herein. Such multilayered or multitiered structures can be used as thermal interface materials (TIMs).
Type:
Grant
Filed:
September 2, 2020
Date of Patent:
March 29, 2022
Assignee:
CARBICE CORPORATION
Inventors:
Baratunde Cola, Leonardo Prinzi, Craig Green
Abstract: Heat sinks containing polymeric protrusions on a base and optionally further including a foil or tape, as well as methods of making and using thereof, are described herein.
Abstract: Multilayered or multitiered structures formed by stacking of vertically aligned carbon nanotube (CNT) arrays and methods of making and using thereof are described herein. Such multilayered or multitiered structures can be used as thermal interface materials (TIMs).
Type:
Grant
Filed:
May 23, 2017
Date of Patent:
September 29, 2020
Assignee:
CARBICE CORPORATION
Inventors:
Baratunde Cola, Leonardo Prinzi, Craig Green
Abstract: Electrical connectors coated with one or more coatings formed of carbon nanotube arrays or sheets, as well as methods of making and using thereof are described herein.
Type:
Grant
Filed:
September 21, 2018
Date of Patent:
July 7, 2020
Assignee:
Carbice Corporation
Inventors:
Baratunde Cola, Craig Green, A. Davin Oetomo
Abstract: Single-layer CNT composites and multilayered or multitiered structures formed therefrom, by stacking of vertically aligned carbon nanotube (CNT) arrays, and methods of making and using thereof are described herein. Such multilayered or multitiered structures can be used as thermal interface materials (TIMs) for a variety of applications, such as burn-in testing.
Abstract: Multilayer substrates for the growth and/or support of CNT arrays are provided. These multilayer substrates both promote the growth of dense vertically aligned CNT arrays and provide excellent adhesion between the CNTs and metal surfaces. Carbon nanotube arrays formed using multilayer substrates, which exhibit high thermal conductivity and excellent durability, are also provided. These arrays can be used as thermal interface materials.
Abstract: Multilayer substrates for the growth and/or support of CNT arrays are provided. These multilayer substrates both promote the growth of dense vertically aligned CNT arrays and provide excellent adhesion between the CNTs and metal surfaces. Carbon nanotube arrays formed using multilayer substrates, which exhibit high thermal conductivity and excellent durability, are also provided. These arrays can be used as thermal interface materials.