Patents Assigned to Carl Zeiss SMT
  • Patent number: 12360459
    Abstract: An optical assembly has an optical element for influencing the beam path in a projection exposure apparatus and an actuator device for deforming the optical element. The actuator device has at least one photostrictive component and at least one light source. The photostrictive component is mechanically coupled to the optical element for the transmission of a tensile and/or compressive force in order to deform the optical element. The light source is configured for targeted illumination of the photostrictive component in order to induce the tensile and/or compressive force in the photostrictive component.
    Type: Grant
    Filed: August 22, 2023
    Date of Patent: July 15, 2025
    Assignee: Carl Zeiss SMT GmbH
    Inventors: Tim Hoffmann, Vladimir Mitev, Eva Schneider, Ruediger Mack, Johannes Schurer, Maike Lorenz
  • Patent number: 12353126
    Abstract: A method for qualifying a mask for a lithography system, the mask having measurement points for detecting critical dimensions of the mask, comprising: first detection of critical dimensions of the mask at the measurement points, the first detection taking place sequentially and the duration of the first detection defining a measurement time period; determining reference measurement points from the measurement points, the number of reference measurement points being less than the number of measurement points; second detection of the at least one critical dimension of the mask at the reference measurement points; determining a deviation between the first and the second detected critical dimension at each of the reference measurement points; and applying a determined temporal profile of the correction factor to the at least one critical dimension to obtain a corrected critical dimension of the mask, and also a corresponding device for qualifying a mask for a lithography system.
    Type: Grant
    Filed: September 27, 2023
    Date of Patent: July 8, 2025
    Assignee: Carl Zeiss SMT GmbH
    Inventors: Asad Rasool, Carola Blaesing-Bangert, Steffen Weissenberg
  • Patent number: 12353137
    Abstract: A field facet system for a lithography apparatus comprises: an optical element which comprises an elastically deformable facet portion having a light-reflecting optically active surface; and at least one actuating element for introducing a bending moment into the facet portion to deform the facet portion to change a radius of curvature of the optically active surface. The facet portion is curved in an arched manner in a plan view of the optically active surface. The rigidity of the facet portion as viewed along a longitudinal direction of the facet portion is variable so that a normal vector oriented perpendicularly to the optically active surface tilts exclusively about a spatial direction when the bending moment is introduced into the facet portion.
    Type: Grant
    Filed: May 16, 2023
    Date of Patent: July 8, 2025
    Assignee: Carl Zeiss SMT GmbH
    Inventors: Arno Schmittner, Willi Anderl, Stefan Lippoldt, Joram Rosseels, Rob Wilhelmus Maria Janssen
  • Patent number: 12353141
    Abstract: A method of heating an optical element in a microlithographic projection exposure apparatus and an optical system includes using a heating arrangement to introduce a heating power into the optical element. The heating power is regulated based on a setpoint value. The setpoint value is varied over time during the operation of the projection exposure apparatus. Varying the setpoint value for the heating power comprises a simulation of the effects of changes in the heating power relative to the actual value thereof based on a model for the thermal behavior of the optical element.
    Type: Grant
    Filed: June 27, 2023
    Date of Patent: July 8, 2025
    Assignee: Carl Zeiss SMT GmbH
    Inventor: Dirk Hellweg
  • Patent number: 12346033
    Abstract: The disclosure provides an optical system, having a first optical control loop, which is set up to regulate a position and/or spatial orientation of a first optical element relative to a first module sensor frame, and a first module control loop, which is set up to regulate a position and/or spatial orientation of the first module sensor frame relative to a base sensor frame. Related components and methods are also provided.
    Type: Grant
    Filed: April 12, 2022
    Date of Patent: July 1, 2025
    Assignee: Carl Zeiss SMT GmbH
    Inventors: Rolf Freimann, Juergen Baier, Steffen Fritzsche
  • Patent number: 12339587
    Abstract: A facet assembly is a constituent part of a facet mirror for an illumination optical unit for projection lithography. The facet assembly has a facet with a reflection surface for reflecting illumination light. A facet main body of the facet assembly has at least one hollow chamber. A reflection surface chamber wall of the hollow chamber forms at least one portion of the reflection surface. An actuator control apparatus of the facet assembly is operatively connected to the hollow chamber for the controlled deformation of the reflection surface chamber wall. The result is a facet assembly that is usable flexibly as a constituent part of a facet mirror equipped therewith within an illumination optical unit for projection lithography.
    Type: Grant
    Filed: October 5, 2022
    Date of Patent: June 24, 2025
    Assignee: Carl Zeiss SMT GmbH
    Inventors: Joachim Hartjes, Alexander Wolf, Toralf Gruner
  • Patent number: 12339589
    Abstract: A micromirror array is a constituent part of an illumination-optical component of a projection exposure apparatus for projection lithography. A multiplicity of micromirrors are in groups in a plurality of mirror modules, each of which has a rectangular module border. The mirror modules are in module columns. At least some of the module columns are displaced with respect to one another along a column boundary line so that at least some of the mirror modules adjacent to one another over the boundary line are arranged displaced with respect to one another. Their module border sides running transversely to the boundary line are not aligned flush with one another. This micromirror array can have a relatively standardized production and can have a relatively small reflection folding angle on the object if the micromirror array represents a final illumination-optical component upstream of a reflective object to be illuminated.
    Type: Grant
    Filed: February 27, 2023
    Date of Patent: June 24, 2025
    Assignee: Carl Zeiss SMT GmbH
    Inventor: Michael Patra
  • Patent number: 12332576
    Abstract: A method for maintaining a projection exposure apparatus comprising at least two modules and a reference element, wherein the modules are referenced to the reference element, comprises: removing a module; attaching a service module to or in the vicinity of the projection exposure apparatus; referencing the service module to the reference element of the projection exposure apparatus; and implementing a maintenance measure with the aid of the service module.
    Type: Grant
    Filed: November 14, 2022
    Date of Patent: June 17, 2025
    Assignee: Carl Zeiss SMT GmbH
    Inventors: Dirk Heinrich Ehm, Jens Kugler, Benjahman Julius Modeste, Marwene Nefzi
  • Patent number: 12321091
    Abstract: The present application relates to a device for determining placements of pattern elements of a reflective photolithographic mask in the operating environment thereof, wherein the device comprises: (a) at least one first means configured for determining surface unevenness data of a rear side of the reflective photolithographic mask and/or surface unevenness data of a mount of the reflective photolithographic mask in a measurement environment that does not correspond to the operating environment; (b) at least one second means configured for determining placement data of the pattern elements in the measurement environment; and (c) at least one computing unit configured for calculating the placements of the pattern elements of the reflective photolithographic mask in the operating environment from the determined surface unevenness data of the rear side and/or of the mount and the determined placement data.
    Type: Grant
    Filed: August 5, 2021
    Date of Patent: June 3, 2025
    Assignee: Carl Zeiss SMT GmbH
    Inventor: Carola Blaesing-Bangert
  • Patent number: 12321106
    Abstract: A device (20) for detecting a temperature on a surface (15) of an optical element (14) for semiconductor lithography. The device includes an optical element (14) having a face (16) irradiated with electromagnetic radiation (7, 8, 43), a temperature recording device (21), and a temperature controlled element (22) configured to be temperature-controlled and arranged so that the predominant proportion of the intensity of the thermal radiation (25.2) detected by the temperature recording device and reflected by reflection at the surface of the optical element is emitted by the temperature-controlled element. Also disclosed are an installation (1) for producing a surface (15) of an optical element (14) for semiconductor lithography and a method for producing a surface (15) of an optical element (14) of a projection exposure apparatus (30), wherein the surface is temperature-controlled and the surface temperature is detected during the temperature control.
    Type: Grant
    Filed: September 22, 2022
    Date of Patent: June 3, 2025
    Assignee: CARL ZEISS SMT GMBH
    Inventors: Michael Stolz, Timo Laufer
  • Patent number: 12321105
    Abstract: A projection exposure apparatus for semiconductor lithography comprises an optical element and a temperature recording device for detecting a temperature on a surface of the optical element via electromagnetic radiation emanating from the surface of the optical element. The temperature recording device can comprise a filter for filtering the electromagnetic radiation.
    Type: Grant
    Filed: September 15, 2022
    Date of Patent: June 3, 2025
    Assignee: Carl Zeiss SMT GmbH
    Inventors: Timo Laufer, Michael Stolz
  • Patent number: 12313978
    Abstract: An optical assembly of a projection exposure apparatus for semiconductor lithography comprises an optical element and an actuator for deforming the optical element. The actuator is subjected to a bias voltage by a controller that is present. A projection exposure apparatus for semiconductor lithography comprises an optical assembly. A method for operating an actuator for deforming an optical element for semiconductor lithography comprises subjecting the actuator to a bias voltage by a controller.
    Type: Grant
    Filed: August 10, 2022
    Date of Patent: May 27, 2025
    Assignee: Carl Zeiss SMT GmbH
    Inventors: Andreas Raba, Johannes Lippert, Markus Raab
  • Patent number: 12292690
    Abstract: An insert for a source chamber of an EUV radiation source has a pressure stage and, spaced apart from it, a stop.
    Type: Grant
    Filed: July 14, 2022
    Date of Patent: May 6, 2025
    Assignee: Carl Zeiss SMT GmbH
    Inventors: Michael Hagg, Juan Jose Hasbun Wood, Iris Pilch, Christof Metzmacher
  • Patent number: 12292680
    Abstract: The present application relates to a method for disposing of excess material of a photolithographic mask, wherein the method comprises the following steps: (a) enlarging a surface of the excess material; (b) displacing the enlarged excess material on the photolithographic mask using at least one first probe of a scanning probe microscope; and (c) removing the displaced enlarged excess material from the photolithographic mask.
    Type: Grant
    Filed: June 10, 2022
    Date of Patent: May 6, 2025
    Assignee: Carl Zeiss SMT GmbH
    Inventors: Michael Budach, Christof Baur, Klaus Edinger, Tristan Bret
  • Patent number: 12293895
    Abstract: The present invention relates to a charged particle beam system comprising a deflection subsystem configured to deflect a charged particle beam in a deflection direction based on a sum of analog signals generated by separate digital to analog conversion of a first digital signal and a second digital signal. The present invention further relates to a method of configuring the charged particle beam system so that each of a plurality of regions of interest can be scanned by varying only the first digital signal while the second digital signal is held constant at a value associated with the respective region of interest. The present invention further relates to a method of recording a plurality of images of the regions of interest at the premise of reduced interference due to charge accumulation.
    Type: Grant
    Filed: October 12, 2023
    Date of Patent: May 6, 2025
    Assignee: Carl Zeiss SMT GmbH
    Inventors: Eugen Foca, Amir Avishai, Thomas Korb, Daniel Fischer
  • Patent number: 12292281
    Abstract: In a method for characterizing the surface shape, the following steps are carried out iteratively: (A) calculating a first figure based on first measurements; (B) subtracting the first figure from first measured values, to determine a first test set-up error; (C) using the first test set-up error for calculating a corrected first figure,; (D) subtracting the corrected first figure from second measured values, to determine a second test set-up error; (E) using the second test set-up error for calculating a corrected second figure; (F) using the corrected second figure for correcting the first test set-up error by subtracting the corrected second figure from the first measured values, to determine a corrected first test set-up error; (G) using the corrected first test set-up error for calculating a first figure corrected once again; and (H) comparing the result with a convergence criterion and optionally repeating steps (A) to (H).
    Type: Grant
    Filed: October 4, 2022
    Date of Patent: May 6, 2025
    Assignee: CARL ZEISS SMT GMBH
    Inventor: Regina Christ
  • Patent number: 12288705
    Abstract: A 3D tomographic inspection method for the inspection of semiconductor features in an inspection volume of a semiconductor wafer includes obtaining a 3D tomographic image, and selecting a plurality of 2D cross section images. The method also includes identifying contours of HAR structures, and extracting deviation parameters. The deviation parameters describe fabrication errors such as displacement, deviation in radius or diameter, area or shape.
    Type: Grant
    Filed: March 29, 2022
    Date of Patent: April 29, 2025
    Assignee: Carl Zeiss SMT GmbH
    Inventors: Amir Avishai, Alex Buxbaum, Eugen Foca, Dmitry Klochkov, Thomas Korb, Keumsil Lee
  • Patent number: 12288272
    Abstract: In order to determine a production aerial image of an object to be measured as a result of an illumination and imaging with illumination and imaging conditions of an optical production system, firstly a measurement aerial image of the object to be measured is captured. This is carried out with illumination and imaging conditions of an optical measurement system, which conditions include a predefined measurement illumination setting. Data of the measurement aerial image are generated during the capturing. An object structure of the object to be measured is reconstructed from the data of the captured measurement aerial image by use of a reconstruction algorithm. Data of the reconstructed object structure are generated during the reconstructing. A production aerial image is simulated from the data of the reconstructed object structure with the illumination and imaging conditions of the optical production system.
    Type: Grant
    Filed: December 10, 2021
    Date of Patent: April 29, 2025
    Assignee: Carl Zeiss SMT GmbH
    Inventors: Martin Dietzel, Renzo Capelli
  • Patent number: 12288706
    Abstract: Semiconductor structures can be investigated, e.g., in an in-line quality check. An x-ray scattering measurement, e.g., CD-SAXS, can be used for wafer metrology. The x-ray scattering measurement can be configured based on a slice-and-imaging tomographic measurement using a dual-beam device, e.g., including a focused ion beam device and a scanning electron microscope.
    Type: Grant
    Filed: April 26, 2022
    Date of Patent: April 29, 2025
    Assignee: Carl Zeiss SMT GmbH
    Inventors: Hans Michael Stiepan, Thomas Korb, Eugen Foca, Alex Buxbaum, Dmitry Klochkov, Jens Timo Neumann
  • Patent number: 12287587
    Abstract: The disclosure relates to a damping arrangement for vibration damping of an element in an optical system, for example in a microlithographic projection exposure apparatus. A damping arrangement according to the disclosure has an element, a fluid located in a cavity, and at least one channel connected to the cavity. A vibration of the element causes vibration energy of the element to be dissipated by partial displacement of the fluid from the cavity into the at least one channel.
    Type: Grant
    Filed: November 8, 2022
    Date of Patent: April 29, 2025
    Assignee: Carl Zeiss SMT GmbH
    Inventors: Marwene Nefzi, Stefan Hembacher, David Schoenen, Jens Kugler