Patents Assigned to Carsem (M) Sdn. Bhd.
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Patent number: 11114367Abstract: A package is disclosed. The package includes a leadframe, and a first die, attached to the leadframe. The package also includes first bond wires, each attached to one of the first bond pads of the first die and to one of the leads of the leadframe, and a package body molded over each of a portion of the die pad of the leadframe, a portion of the leads of the leadframe, a first portion of the first die, and one or more of the first bond wires. The molded package body defines a cavity, and a second portion of the first die contacts neither of the die pad and the package body. The package also includes a second die having second bond pads, where the second die is attached to the first die. The package also includes second bond wires, each attached to the first and second die.Type: GrantFiled: September 10, 2019Date of Patent: September 7, 2021Assignee: Carsem (M) SDN. BHD.Inventors: Lily Khor, Phuah Kian Keung
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Publication number: 20200219800Abstract: A package is disclosed. The package includes a leadframe, and a first die, attached to the leadframe. The package also includes first bond wires, each attached to one of the first bond pads of the first die and to one of the leads of the leadframe, and a package body molded over each of a portion of the die pad of the leadframe, a portion of the leads of the leadframe, a first portion of the first die, and one or more of the first bond wires. The molded package body defines a cavity, and a second portion of the first die contacts neither of the die pad and the package body. The package also includes a second die having second bond pads, where the second die is attached to the first die. The package also includes second bond wires, each attached to the first and second die.Type: ApplicationFiled: September 10, 2019Publication date: July 9, 2020Applicant: Carsem (M) SDN. BHD.Inventors: Lily Khor, Phuah Kian Keung
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Patent number: 10468319Abstract: An electronic package is formed by placing a semiconductor die within an opening in a leadframe and performing a first molding operation. The die is wirebonded to the leadframe and a final encapsulation is performed with a second molding operation.Type: GrantFiled: April 20, 2017Date of Patent: November 5, 2019Assignee: CARSEM (M) SDN. BHD.Inventors: Yan Shan Ng, Lily Khor
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Patent number: 10147700Abstract: A window clamp includes a center portion, side portions, and flexible members. The side portions are arranged on opposing sides of the center portion. The flexible members extend between the side portions and the center portion. The flexible members allow movement of the center portion in X, Y, and Z directions independent of movement of the side portions.Type: GrantFiled: February 23, 2017Date of Patent: December 4, 2018Assignee: Carsem (M) Sdn. Bhd.Inventors: Wong Chee Heng, Yee Kwong Cheong, Regis Arul Raj
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Publication number: 20180211902Abstract: A leadframe with pre-molded cavities includes an outer frame and a plurality of units. Each unit includes a die pad and a plurality of leads. For each unit, a molding compound extends over a first portion of an upper surface of each of the leads that is located farthest from the die pad. The molding compound may also extend over an upper surface of the die pad. A second portion of the upper surface of each of the plurality of leads that is located nearest the die pad remains exposed outside the molding compound. A thickness of the molding compound covering the first portion of the upper surface of each of the leads is greater than a thickness of the molding compound covering the upper surface of the die pad.Type: ApplicationFiled: March 20, 2018Publication date: July 26, 2018Applicant: Carsem (M) SDN. BHD.Inventors: Lily Khor, Lynn Simporios Guirit
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Patent number: 9935039Abstract: A leadframe with pre-molded cavities includes an outer frame and a plurality of units. Each unit includes a die pad and a plurality of leads. For each unit, a molding compound extends over a first portion of an upper surface of each of the leads that is located farthest from the die pad. The molding compound may also extend over an upper surface of the die pad. A second portion of the upper surface of each of the plurality of leads that is located nearest the die pad remains exposed outside the molding compound. A thickness of the molding compound covering the first portion of the upper surface of each of the leads is greater than a thickness of the molding compound covering the upper surface of the die pad.Type: GrantFiled: November 10, 2014Date of Patent: April 3, 2018Assignee: Carsem (M) SDN. BHD.Inventors: Lily Khor, Lynn Simporios Guirit
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Patent number: 9691688Abstract: A method of making electronic packages includes providing a leadframe strip that includes a plurality of leadframes, wherein the leadframes comprise a plurality of leads, etching a surface of each of the leadframes to form an opening, wherein each of the leads has a lead tip that connects to a die paddle within the opening, isolating each of the leads from the die paddle, adhering a tape to a bottom side of the leadframe strips, leads, and die paddle, attaching a die to the die paddle, placing ball bumps on each of the lead tips, and connecting the die to the ball bumps.Type: GrantFiled: October 26, 2015Date of Patent: June 27, 2017Assignee: CARSEM (M) SDN. BHD.Inventors: Mow Lum Yee, Kam Chuan Lau, Kok Siang Goh, Shang Yan Choong, Voon Joon Liew, Chee Sang Yip
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Patent number: 9640517Abstract: A stacked electronic package includes a substrate and conductive straps each having sides, a top, and a bottom opposite the top. Each conductive strap is coupled along the bottom to an upper surface of the substrate and is separate from others of the conductive straps. A length of at least one of the sides is greater than a width of at least another one of the sides. An encapsulant extends over the upper surface and side surfaces of the substrate and the sides of the conductive straps. A passive electronic component is disposed over the conductive straps, and each conductive strap is coupled along the top to a terminal of the passive electronic component.Type: GrantFiled: October 29, 2014Date of Patent: May 2, 2017Assignee: CARSEM (M) SDN. BHD.Inventors: Thong Kai Choh, Lily Khor, Oo Choo Yee
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Patent number: 9190385Abstract: A method of making electronic packages includes providing a leadframe strip that includes a plurality of leadframes, wherein the leadframes comprise a plurality of leads, etching a surface of each of the leadframes to form an opening, wherein each of the leads has a lead tip that connects to a die paddle within the opening, isolating each of the leads from the die paddle, adhering a tape to a bottom side of the leadframe strips, leads, and die paddle, attaching a die to the die paddle, placing ball bumps on each of the lead tips, and connecting the die to the ball bumps.Type: GrantFiled: October 30, 2007Date of Patent: November 17, 2015Assignee: Carsem (M) SDN. BHD.Inventors: Mow Lum Yee, Kam Chuan Lau, Kok Siang Goh, Shang Yan Choong, Voon Joon Liew, Chee Sang Yip
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Patent number: 9048397Abstract: A method of disposing a phosphor material on an LED such that the LED emits white light and adjusting the quantity of phosphor material such that the white light meets a color target. A formulated procedure is used to determine the adjustment required, and includes a correlation between a change in position of a color of an LED on a CIE diagram and a known quantity of phosphor material added to the LED.Type: GrantFiled: January 6, 2014Date of Patent: June 2, 2015Assignee: Carsem (M) SDN. BHD.Inventors: Edmund Sales Cabatbat, Lily Khor, Ho Tuck Ming
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Publication number: 20150087087Abstract: A method of disposing a phosphor material on an LED such that the LED emits white light and adjusting the quantity of phosphor material such that the white light meets a color target. A formulated procedure is used to determine the adjustment required, and includes a correlation between a change in position of a color of an LED on a CIE diagram and a known quantity of phosphor material added to the LED.Type: ApplicationFiled: January 6, 2014Publication date: March 26, 2015Applicant: CARSEM (M) SDN. BHD.Inventors: Edmund Sales Cabatbat, Lily Khor, Ho Tuck Ming
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Patent number: 8946913Abstract: A multi-die package includes a first semiconductor die and a second semiconductor die each having an upper surface with a plurality of bond pads disposed thereon. The upper surface of the second semiconductor die may be substantially coextensive with the upper surface of the first semiconductor die and extend substantially along a plane. The multi-die package also includes a plurality of bonding wires each coupling one of the bond pads on the upper surface of the first semiconductor die to a corresponding one of the bond pads on the upper surface of the second semiconductor die. A bonding wire of the plurality of bonding wires has a kink disposed at a height above the plane, a first hump disposed between the first semiconductor die and the kink, and a second hump disposed between the second semiconductor die and the kink.Type: GrantFiled: August 12, 2013Date of Patent: February 3, 2015Assignee: Carsem (M) SDN. BHD.Inventors: Liew Siew Har, Law Wai Ling
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Patent number: 8941249Abstract: A multi-die package includes a first semiconductor die and a second semiconductor die each having an upper surface with a plurality of bond pads positioned thereon. The multi-die package also includes a plurality of bonding wires each coupling one of the bond pads on the upper surface of the first semiconductor die to a corresponding one of the bond pads on the upper surface of the second semiconductor die. A bonding wire of the plurality of bonding wires includes a first portion extending upward from one of the second plurality of bond pads substantially along a z-axis and curving outward substantially along x and y axes in a direction towards the first semiconductor die. The bonding wire also includes a second portion coupled to the first portion and extending from the first portion downward to one of the first plurality of bond pads on the upper surface of the first semiconductor die.Type: GrantFiled: July 16, 2013Date of Patent: January 27, 2015Assignee: Carsem (M) SDN, BHD.Inventors: Liew Siew Har, Law Wai Ling
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Patent number: 8674488Abstract: A method of manufacturing an LED package includes mounting a large panel frame/substrate (LPF/S) having a substantially square shape to a ring. The LPF/S includes a plurality of die pads and a corresponding plurality of leads arranged in a matrix pattern. Each of the die pads includes a planar chip attach surface. An LED chip is attached to the planar chip attach surface of each of the die pads. An encapsulant material is applied overlaying the LED chips and at least a part of the LPF/S. Each die pad and corresponding leads are separated from the LPF/S to form individual LED packages. The steps of attaching the LED chips and applying the encapsulant material are performed while the LPF/S is mounted to the ring.Type: GrantFiled: February 13, 2013Date of Patent: March 18, 2014Assignee: Carsem (M) SDN. BHD.Inventors: Yong Lam Wai, Chan Boon Meng, Phang Hon Keat
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Publication number: 20140021491Abstract: In certain embodiments, a semiconductor package includes a leadframe, a light emitter die disposed on the leadframe, and a light detector die disposed on the leadframe adjacent to the light emitter die. In some embodiments, a first transparent molding compound is disposed over the light emitter die and a second transparent molding compound is disposed over the light detector die. The first and second transparent molding compound may be disposed such that a space between them forms a cavity between the die and above the leadframe. In other embodiments a transparent molding compound is disposed simultaneously over the light emitter and light detector die and a subsequent material removal process forms a cavity within the compound between the die. In both embodiments, an opaque molding compound is disposed in the cavity between the die, and is configured to block optical cross-talk between the light emitter and light detector die.Type: ApplicationFiled: January 28, 2013Publication date: January 23, 2014Applicant: CARSEM (M) SDN. BHD.Inventors: Chan Boon Meng, Lee Yoke Foo, Kum Chun Cheong
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Publication number: 20130328194Abstract: A multi-die package includes a first semiconductor die and a second semiconductor die each having an upper surface with a plurality of bond pads disposed thereon. The upper surface of the second semiconductor die may be substantially coextensive with the upper surface of the first semiconductor die and extend substantially along a plane. The multi-die package also includes a plurality of bonding wires each coupling one of the bond pads on the upper surface of the first semiconductor die to a corresponding one of the bond pads on the upper surface of the second semiconductor die. A bonding wire of the plurality of bonding wires has a kink disposed at a height above the plane, a first hump disposed between the first semiconductor die and the kink, and a second hump disposed between the second semiconductor die and the kink.Type: ApplicationFiled: August 12, 2013Publication date: December 12, 2013Applicant: CARSEM (M) SDN. BHD.Inventors: Liew Siew Har, Law Wai Ling
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Patent number: 8535988Abstract: A method of manufacturing an integrated circuit package includes mounting a large panel leadframe having a substantially square shape to a ring. The large panel leadframe includes a plurality of die pads and a corresponding plurality of leads arranged in a matrix pattern. An integrated circuit chip is attached to each of the die pads. An encapsulant material is applied over the integrated circuit chips and at least a part of the large panel leadframe. Each of the die pads and its corresponding leads are separated from the large panel leadframe to form individual integrated circuit packages. The steps of attaching the integrated circuit chips and applying the encapsulant material are performed while the large panel leadframe is mounted to a taped ring.Type: GrantFiled: May 25, 2012Date of Patent: September 17, 2013Assignee: Carsem (M) Sdn. Bhd.Inventors: Yong Lam Wai, Chan Boon Meng, Phang Hon Keat
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Patent number: 8525352Abstract: A multi-die package includes a first semiconductor die and a second semiconductor die each having an upper surface with a plurality of bond pads disposed thereon. The upper surface of the second semiconductor die may be substantially coextensive with the upper surface of the first semiconductor die and extend substantially along a plane. The multi-die package also includes a plurality of bonding wires each coupling one of the bond pads on the upper surface of the first semiconductor die to a corresponding one of the bond pads on the upper surface of the second semiconductor die. A bonding wire of the plurality of bonding wires has a kink disposed at a height above the plane, a first hump disposed between the first semiconductor die and the kink, and a second hump disposed between the second semiconductor die and the kink.Type: GrantFiled: September 8, 2011Date of Patent: September 3, 2013Assignee: Carsem (M) sdn.bhd.Inventors: Liew Siew Har, Law Wai Ling
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Publication number: 20130221382Abstract: A method of manufacturing an LED package includes mounting a large panel frame/substrate (LPF/S) having a substantially square shape to a ring. The LPF/S includes a plurality of die pads and a corresponding plurality of leads arranged in a matrix pattern. Each of the die pads includes a planar chip attach surface. An LED chip is attached to the planar chip attach surface of each of the die pads. An encapsulant material is applied overlaying the LED chips and at least a part of the LPF/S. Each die pad and corresponding leads are separated from the LPF/S to form individual LED packages. The steps of attaching the LED chips and applying the encapsulant material are performed while the LPF/S is mounted to the ring.Type: ApplicationFiled: February 13, 2013Publication date: August 29, 2013Applicant: Carsem (M) SDN. BHD.Inventor: Carsem (M) SDN. BHD.
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Patent number: 8513819Abstract: A multi-die package includes a first semiconductor die and a second semiconductor die each having an upper surface with a plurality of bond pads positioned thereon. The multi-die package also includes a plurality of bonding wires each coupling one of the bond pads on the upper surface of the first semiconductor die to a corresponding one of the bond pads on the upper surface of the second semiconductor die. A bonding wire of the plurality of bonding wires includes a first portion extending upward from one of the second plurality of bond pads substantially along a z-axis and curving outward substantially along x and y axes in a direction towards the first semiconductor die. The bonding wire also includes a second portion coupled to the first portion and extending from the first portion downward to one of the first plurality of bond pads on the upper surface of the first semiconductor die.Type: GrantFiled: July 31, 2012Date of Patent: August 20, 2013Assignee: Carsem (M) SDN. BHD.Inventors: Liew Siew Har, Law Wai Ling