Patents Assigned to Carsen Semiconductor SDN. BHD.
  • Stress-free lead frame
    Patent number: 6867483
    Abstract: The present invention relates to a stress-free lead frame (1) for a semiconductor. The stress-free lead frame (1) is provided with a stress-relief means (15) and an interlocking means (16) at the outer periphery. The stress-relief means (15) is capable of accommodating expansion and compression while the interlocking means (16) take care of shock and vibration during handling to thereby eliminate delamination of the lead frame (10).
    Type: Grant
    Filed: July 20, 2001
    Date of Patent: March 15, 2005
    Assignee: Carsen Semiconductor SDN. BHD.
    Inventors: Lee Kock Huat, Chan Boon Meng, Cheong Mun Tuck, Lee Huan Sin, Phuah Kian Keung, Araventhan Eturajulu, Liow Eng Keng, Thum Min Kong, Chen Choon Hing