Abstract: A direct current and a modulation signal are simultaneously applied to contact pads on a wafer to test certain devices, such as a laser diode. A probe, probing system, and method of probing reduces signal distortion and power dissipation by transmitting a modulated signal to the device-under-test through an impedance matching resistor and transmitting of a direct current to the device-under-test over a signal path that avoids the impedance matching resistor.
Type:
Grant
Filed:
November 12, 2003
Date of Patent:
October 19, 2004
Assignee:
Cascaded Microtech, Inc.
Inventors:
Leonard Hayden, Scott Rumbaugh, Mike Andrews