Patents Assigned to Casio Micronics Co., Ltd.
  • Wiring board, method of manufacturing the same, and semiconductor device
    Patent number: 7755183
    Abstract: According to this invention, a wiring board includes a conductive pattern formed from leads each of which is formed on an organic layer and has a thickness t larger than a width W.
    Type: Grant
    Filed: March 18, 2005
    Date of Patent: July 13, 2010
    Assignee: Casio Micronics Co., Ltd.
    Inventor: Mitsuhiko Yamamoto
  • Semiconductor device and method of manufacturing same
    Patent number: 7279792
    Abstract: According to this invention, a semiconductor device has an upper surface on which an external connection electrode is formed and a lower surface which opposes the upper surface and is in a mirror surface state. A roughened region roughened by laser marking is formed at part of the lower surface. The roughened region includes a product information mark of the semiconductor device itself. The product information mark is printed by laser marking. The number, size, shape, and layout position of the roughened regions are decided to make it possible to, when the lower surface is irradiated with light, read the product information from the difference in light reflectance between the roughened region and mirror-finished region.
    Type: Grant
    Filed: May 10, 2004
    Date of Patent: October 9, 2007
    Assignee: Casio Micronics Co., Ltd
    Inventor: Kinichi Naya
  • Resin film forming method and resin film forming apparatus employing said method
    Patent number: 6576288
    Abstract: Where the length LD of a resin film forming region is, for example, 3 times as long as the pitch of the sprocket holes of the base film, the resin coating is performed by using 6 nozzles, and where the length LD is, for example, 6 times as long as the pitch of the sprocket holes, the resin coating is performed by using 3 nozzles. As a result, the transfer distance of the base film transferred in a single resin coating process is 18 times as long as the pitch of the sprocket holes. It follows that it is possible to set constant the time for the base film to pass through the drying section even if the length LD of the resin film forming region differs.
    Type: Grant
    Filed: December 14, 2000
    Date of Patent: June 10, 2003
    Assignees: Casio Computer Co., Ltd., Casio Micronics Co., Ltd.
    Inventor: Katsuya Ogita
  • Method of manufacturing flexible wiring board
    Patent number: 6433414
    Abstract: A flexible wiring board is provided which is made of a relatively thin polyimide film and, thus, can be bent easily. Therefore, the flexible wiring board can be bent easily in the vicinity of a semiconductor chip mounting region without forming slits for facilitating the bending in the film substrate. As a result, it is possible to decrease the length of that portion of the flexible wiring board which is positioned ahead of the semiconductor chip mounting region.
    Type: Grant
    Filed: January 19, 2001
    Date of Patent: August 13, 2002
    Assignees: Casio Computer Co., Ltd., Casio Micronics Co., Ltd.
    Inventor: Hirokazu Saito