Patents Assigned to Caswell Inc.
  • Patent number: 10511529
    Abstract: A packet processing method for a virtual switch is carried out in a virtual switch under the SDN architecture. The method presets a signature pre-computation table including plural destination addresses and signatures corresponding to the destination addresses. With the installation of the signature pre-computation table, the destination addresses fall into packets of the signature pre-computation table without requiring computing the signature of the packet. The method simply obtains the corresponding signature according to the destination address of the packet destination address, and thus saves the time required for processing a packet and improves the throughput of the virtual switch.
    Type: Grant
    Filed: January 27, 2017
    Date of Patent: December 17, 2019
    Assignee: CASWELL, INC.
    Inventors: Yen-Hsiang Chen, Jen-Chieh Cheng, I-Cheng Shen, Yuh-Shyan Chen, Tai-Xiang Liao
  • Patent number: 8482925
    Abstract: A high-density computer system comprises: a chassis, having a main backplane, and a main control circuit and a plurality of main backplane slots installed and formed on the main backplane respectively; at least one expansion card module inserted and installed in the chassis, and the expansion card module includes a sub-backplane having a sub-control circuit and a plurality of second sub-backplane slots, and an end of the sub-backplane has a first sub-backplane slot corresponding to the main backplane slot, and the first sub-backplane slot and the sub-control circuit and the second sub-backplane slots being electrically coupled; a plurality of CPU cards installed on the expansion card module, each being inserted to the second sub-backplane slot, and the CPU card having a CPU, such that the computer system can have a powerful modular assembling function to enhance the economic benefits and product competitiveness.
    Type: Grant
    Filed: May 27, 2011
    Date of Patent: July 9, 2013
    Assignee: Caswell Inc.
    Inventors: Chih-Wei Yang, Shin-Jau Li, Shih-Hua Huang
  • Patent number: 8341830
    Abstract: A quick circuit board press-mount device comprises: a positioning device, having a positioning board and a back board, and the positioning board having an adjusting knob with a screw rod portion, and the back board having an adjusting notch; an adjusting device, having a combining board, an insert board extended forward from the front end of the combining board, and the insert board having a screw hole for securing the screw rod portion, and the insert board being inserted into the adjusting notch, and the insert board having a lateral connecting board extended from a side from the combining board, and the lateral connecting board having an oblong adjusting slot for securing a position screw hole of the back board by a screw rod; and a press-mount element, coupled to the combining board, so that the circuit board module and the interface card can be mounted conveniently and quickly.
    Type: Grant
    Filed: May 27, 2011
    Date of Patent: January 1, 2013
    Assignee: Caswell Inc.
    Inventor: Ming-Feng Cheng
  • Publication number: 20110292589
    Abstract: A high-density computer system comprises: a chassis, having a main backplane, and a main control circuit and a plurality of main backplane slots installed and formed on the main backplane respectively; at least one expansion card module inserted and installed in the chassis, and the expansion card module includes a sub-backplane having a sub-control circuit and a plurality of second sub-backplane slots, and an end of the sub-backplane has a first sub-backplane slot corresponding to the main backplane slot, and the first sub-backplane slot and the sub-control circuit and the second sub-backplane slots being electrically coupled; a plurality of CPU cards installed on the expansion card module, each being inserted to the second sub-backplane slot, and the CPU card having a CPU, such that the computer system can have a powerful modular assembling function to enhance the economic benefits and product competitiveness.
    Type: Application
    Filed: May 27, 2011
    Publication date: December 1, 2011
    Applicant: CASWELL INC.
    Inventors: Chih-Wei YANG, Shin-JAU LI, Shih-Hua HUANG