Abstract: A compound material at least comprises a pair of overlapped high heat conductive layer and electromagnetic interference (EMI) shielding layer. The EMI shielding layer includes a high heat conductive sub-layer and a plurality of EMI shielding blocks thereby forming an EMI shielding net and a heat conducting track with the cooperation of the overlapped heat conductive layer in the meantime. The compound material further comprises a second EMI shielding layer overlapped on the side of the heat conductive layer which is opposite to said EMI shielding layer and having a plurality of EMI shielding blocks, which are arranged in a similar as and are staggered from the EMI shielding blocks of said EMI shielding layer in the overlapped or vertical direction thereof.