Abstract: A method is provided for determining a decoupling capacitance of a device under test (DUT) interface circuitry, which is between automated testing equipment (ATE) and a DUT. The method: disconnects the DUT from the DUT interface circuitry; connects a Device Under Testing Power Supply (DPS) resource as a DUT Power Supply to the DUT interface circuitry; sets a current clamp of the DPS resource to a test application level; turns off the DPS resource voltage; sets the DPS resource to a force voltage mode; sets the current clamp to a minimum current level; turns on the output; waits a period of time to allow the decoupling capacitance to charge; places the DPS resource into a voltage measurement mode; adds any delay time to the period of time; measures the voltage before the capacitance is fully charged; and determines the decoupling capacitance.

Abstract: A method is provided for determining a decoupling capacitance of a device under test (DUT) interface circuitry, which is between automated testing equipment (ATE) and a DUT. The method: disconnects the DUT from the DUT interface circuitry; connects a Device Under Testing Power Supply (DPS) resource as a DUT Power Supply to the DUT interface circuitry; sets a current clamp of the DPS resource to a test application level; turns off the DPS resource voltage; sets the DPS resource to a force voltage mode; sets the current clamp to a minimum current level; turns on the output; waits a period of time to allow the decoupling capacitance to charge; places the DPS resource into a voltage measurement mode; adds any delay time to the period of time; measures the voltage before the capacitance is fully charged; and determines the decoupling capacitance.

Abstract: A method for compliance testing of a Digital Interface Board attached to Automatic Test Equipment in the testing of integrated circuit semiconductor devices using Impedance Response Profiling. The includes launching alternating voltage digital clock signals from the Pin Electronics to one or more circuit paths in the Digital Interface Board, and sampling a mix of the launched alternating voltage digital clock signals and reflected signals. The method also includes compositing time domain waveforms originating at the Pin Electronics, and generating an initial reflection response profile baseline. The method is repeated at a later predetermined time, generating a later reflection response profile. The method further includes comparing the initial reflection response profile baseline with the later reflection response profile, and determining whether the one or more circuit paths of the Digital Interface Board are in compliance with predetermined operating standards.

Abstract: A method is provided for testing the functionality of a device under test interface circuitry located between automated testing equipment (ATE) and a device under test (DUT). The method includes disconnecting the device under test from the device under test interface circuitry, utilizing a Source Measurement Unit (SMU) that generates and measures voltage and current and uses force and sense lines, and testing a switch located in the device under test interface circuitry using a two-state alarm process. The method also includes applying a voltage using the a voltage source measurement device in a first state in which force and sense lines of the voltage source measurement device are connected in the device under test interface circuitry. The method further includes detecting whether an alarm signal due to an open circuit has been activated, and determining that the switch being tested in the device under test interface circuitry is operating properly by the absence of the alarm signal being activated.

Abstract: A method is provided for in situ functionality testing of electrical switches using a Functional Reflectometry Test (FRT) of switches on the signal path of electrical circuits in a semiconductor interface. The method includes initiating the functionality testing of the electrical switches in situ, wherein the functionality of the electrical switches is tested while the electrical switches are connected to the Automatic Test Equipment (ATE) and are in-use testing semiconductors. The method also includes conducting full Functional Reflectometry Testing of the electrical switches in situ in an open switch state and a closed switch state to determine whether each of the electrical switches is one of fully functional, stuck closed, and stuck open, wherein testing for each state is performed as a single vector functional test to minimize test time overhead.

Abstract: Methods are provided that performs continuous semiconductor testing during long soak time testing using a chamberless single insertion model (SIM) handler and also using a chamberless asynchronous insertion model (AIM) handler having two manipulators. The methods include dividing a group of semiconductors having an ambient temperature into a first subgroup having a plurality of portions and a second subgroup having a plurality of portions, the second subgroup being identical to the first subgroup. The methods also include using thermal chucks to change the temperature of the first portion of the first subgroup and the first portion of a second subgroup prior to testing from ambient temperature to a stabilized designated temperature during a soak time. The methods also include testing all of the portions of the first subgroup and the second subgroup using predetermined protocols that include Soak Time, Test Time, Index Time, and sometimes Wait Time.

Abstract: A method for compliance testing of a Digital Interface Board attached to Automatic Test Equipment in the testing of integrated circuit semiconductor devices using Impedance Response Profiling. The includes launching alternating voltage digital clock signals from the Pin Electronics to one or more circuit paths in the Digital Interface Board, and sampling a mix of the launched alternating voltage digital clock signals and reflected signals. The method also includes compositing time domain waveforms originating at the Pin Electronics, and generating an initial reflection response profile baseline. The method is repeated at a later predetermined time, generating a later reflection response profile. The method further includes comparing the initial reflection response profile baseline with the later reflection response profile, and determining whether the one or more circuit paths of the Digital Interface Board are in compliance with predetermined operating standards.

Abstract: A method is provided for in situ functionality testing of electrical switches using a Functional Reflectometry Test (FRT) of switches on the signal path of electrical circuits in a semiconductor interface. The method includes initiating the functionality testing of the electrical switches in situ, wherein the functionality of the electrical switches is tested while the electrical switches are connected to the Automatic Test Equipment (ATE) and are in-use testing semiconductors. The method also includes conducting full Functional Reflectometry Testing of the electrical switches in situ in an open switch state and a closed switch state to determine whether each of the electrical switches is one of fully functional, stuck closed, and stuck open, wherein testing for each state is performed as a single vector functional test to minimize test time overhead.

Abstract: Methods are provided that performs continuous semiconductor testing during long soak time testing using a chamberless single insertion model (SIM) handler and also using a chamberless asynchronous insertion model (AIM) handler having two manipulators. The methods include dividing a group of semiconductors having an ambient temperature into a first subgroup having a plurality of portions and a second subgroup having a plurality of portions, the second subgroup being identical to the first subgroup. The methods also include using thermal chucks to change the temperature of the first portion of the first subgroup and the first portion of a second subgroup prior to testing from ambient temperature to a stabilized designated temperature during a soak time. The methods also include testing all of the portions of the first subgroup and the second subgroup using predetermined protocols that include Soak Time, Test Time, Index Time, and sometimes Wait Time.

Abstract: A method is provided for testing the functionality of a device under test interface circuitry located between automated testing equipment (ATE) and a device under test (DUT). The method includes disconnecting the device under test from the device under test interface circuitry, utilizing a Source Measurement Unit (SMU) that generates and measures voltage and current and uses force and sense lines, and testing a switch located in the device under test interface circuitry using a two-state alarm process. The method also includes applying a voltage using the a voltage source measurement device in a first state in which force and sense lines of the voltage source measurement device are connected in the device under test interface circuitry. The method further includes detecting whether an alarm signal due to an open circuit has been activated, and determining that the switch being tested in the device under test interface circuitry is operating properly by the absence of the alarm signal being activated.

Abstract: A method is provided for performing continuous single insertion semiconductor testing of a group of semiconductors that are divided into a first subgroup and a second subgroup at multiple different temperatures. The single insertion semiconductor testing is performed by sequentially executing testing cycles, characterized by the tester alternately executing temperature testing periods and temperature ramping periods for the first subgroup, while simultaneously executing temperature ramping periods and temperature testing periods for the second subgroup. The temperature testing periods operate at two or more different temperatures. The single insertion testing sequence entirely eliminates tester index time when the testing time is equal to or greater than the ramping times, and substantially reduces tester index time when the testing time is less that the ramping times.

Abstract: A method is provided for performing continuous single insertion semiconductor testing of a group of semiconductors that are divided into a first subgroup and a second subgroup at multiple different temperatures. The single insertion semiconductor testing is performed by sequentially executing testing cycles, characterized by the tester alternately executing temperature testing periods and temperature ramping periods for the first subgroup, while simultaneously executing temperature ramping periods and temperature testing periods for the second subgroup. The temperature testing periods operate at two or more different temperatures. The single insertion testing sequence entirely eliminates tester index time when the testing time is equal to or greater than the ramping times, and substantially reduces tester index time when the testing time is less that the ramping times.

Abstract: A method is provided for testing a semiconductor wafer, including individual semiconductor devices located on the semiconductor wafer, using temporary counterpart sacrificial bond pads. The method includes arranging individual semiconductor devices on the semiconductor wafer in a configuration having horizontal rows of the individual semiconductor devices separated by functional horizontal scribe lanes, and having vertical columns of individual semiconductor devices separated by functional vertical scribe lanes. The method includes creating the temporary counterpart sacrificial bond pads, located in the functional horizontal scribe lanes and/or vertical scribe lanes, that are electrically connected to corresponding normal individual bond pads located on individual semiconductor devices.

Abstract: A system for connecting a test pin of automatic test equipment (ATE) to devices for testing includes a first handler for manipulating a first portion of the devices and a second handler for manipulating a second portion of the devices. The system includes a first socket for testing devices of the first portion, which is connected to a first wire, and a second socket for testing devices of the second portion, which is connected to a the second wire. A controller multiplexes the two handlers, or dual manipulators of a single handler, to operate the handlers asynchronously in coordination with testing, such that while the ATE is testing devices for one handler, the other handler presents next devices to the ATE for immediate switch of testing between devices for each handler. The system is suitable for conventional handlers and ATE.

Abstract: A system for communicatively connecting devices for testing to respective test pins of a test head of an automatic test equipment (ATE). The system includes a tester interface device for communicative connection to the test pins of the ATE. The tester interface device includes a first connector and a second connector. The first connector is communicatively connected by the tester interface device to a first group of the test pins and the second connector is communicatively connected by the tester interface device to a second group of the test pins. The first group and the second group can be different test pins, same test pins, or combinations of some same and some different test pins. The system may also include a first pogo pin block device and a second pogo pin block device.

Abstract: A parallel concurrent test (PCT) system is provided for performing the parallel concurrent testing of semiconductor devices. The PCT system includes a pick and place (PnP) handler for engaging and transporting the semiconductor devices along a testing plane, the PnP handler including at least one manipulator. The PCT system also includes a device under test interface board (DIB), the DIB including a broadside test socket for broadside (BS) testing of the semiconductor devices, the broadside testing using at least half of a total number of a semiconductor device pins, and a plurality of design-for-test (DFT) test sockets for DFT testing, the DFT testing using less than half of the total number of the semiconductor device pins, and a tester in electrical contact with the DIB for testing the semiconductor devices in accordance with a stepping pattern test protocol.

Abstract: A method is provided for testing a semiconductor wafer, including individual semiconductor devices located on the semiconductor wafer, using temporary counterpart sacrificial bond pads. The method includes arranging individual semiconductor devices on the semiconductor wafer in a configuration having horizontal rows of the individual semiconductor devices separated by functional horizontal scribe lanes, and having vertical columns of individual semiconductor devices separated by functional vertical scribe lanes. The method includes creating the temporary counterpart sacrificial bond pads, located in the functional horizontal scribe lanes and/or vertical scribe lanes, that are electrically connected to corresponding normal individual bond pads located on individual semiconductor devices.

Abstract: A system for testing with an automated test equipment (ATE) includes a tester having at least one test resource, a tandem handler, and a mux relay that switchably connects the test resource, via parallel connections, to either one of dual sockets at each instant of testing. The handler has first and second manipulator arms. Each arm operates as to a particular one of the respective sockets, to retrieve a next device to be tested and position the device in the socket (while testing is performed on a device in the other socket), to disposition the device from the socket once testing is completed as to the device in the socket, and thereafter repeat until all staged devices for testing have been tested (or an interruption of testing otherwise occurs). The mux relay switches between sockets in response to the tandem handler acting as a master and the tester as slave.