Patents Assigned to Centech Services, Inc.
  • Patent number: 9444232
    Abstract: A site grounding and bonding system provides for the grounding of a plurality of facilities at a field site using a ground box through which electrical connections are made between one or more ground devices and a distribution panel electrically connected to the facilities. The grounding devices may include one or more grounding plates and one or more ground rods buried beneath the earth. A bumper pole may be placed adjacent to the ground box and bonded to the grounding devices through the ground box. The system allows for the safe grounding of a number of facilities at a site without the necessity of placing separate grounding rods and connecting conductors for each facility.
    Type: Grant
    Filed: April 29, 2015
    Date of Patent: September 13, 2016
    Assignee: Centech Services, Inc.
    Inventor: David Warren