Abstract: Polyimide precursor compositions incorporating at least one compound of fula (1), at least one compound of formula (2), at least one compound of formula (3) and at least one compound of formula (4) ##STR1## in which one of the groups R.sup.3 and R.sup.4 represents a hydrogen atom and the other, in the same way as the groups R.sup.1 and R.sup.2, which can be the same or different, in each case represent a hydrocarbon group having 1 to 16 carbon atoms, m is a number between 5 and 20, n is an integer between 1 and 5 and R.sup.5 represents a hydrogen atom, a halogen atom, a hydrocarbon group with 1 to 16 carbon atoms, or a group of formula R.sup.6 --O-- in which R.sup.6 represents a hydrocarbon group having 1 to 16 carbon atoms. The preferred composition contains 30 to 70% by weight of dry matter of compounds of formulas (1), (2) and (3), in which the groups R.sup.1, R.sup.2 and one of the groups R.sup.3 and R.sup.4 is a methyl or ethyl group and the compound of formula (4) is benzyl alcohol.

Abstract: Adhesive compositions are described comprising at least an arylaliphatic olyimide with ether chain formations, obtained by the polycondensation reaction of a tetracarboxylic aromatic acid or of one of its derivatives with at least two primary diamines, one of these diamines consisting of a polyether chain ending with the two amine functional groups and at least an epoxy resin possessing more than one epoxy group per molecular.These adhesive compositions can be used particularly for the gluing of films of polymers to thin metal sheets.

Abstract: Thermosetting Schiff base resins, their preparation and their applications re described.These thermosetting Schiff base resins can be defined as responding to the general formula: ##STR1## Radicals Ar.sub.1, Ar.sub.2 and Ar.sub.3 are chosen so that the softening temperature of the resins is less than about 150.degree. C.The resins can be prepared by direct condensation of an ethynyl benzaldehyde or acetophenone on a telechelic diamine oligomer obtained by reaction of a diamine containing flexibilizing groups on a derivative of benzhydrol tetracarboxylic acid. These Schiff base resins can be used by bulk thermal polymerization particularly to prepare adhesives or composite matrices.

Abstract: Expanded material obtained by heating a composition comprising at least one hermosetting nadimide resin, said heating being performed at a temperature and during a period which are sufficient to cause the expansion of said composition by release of cyclopentadiene. A nadimide resin of the polyimide type and having a number average molecular weight of 600 to 10,000 is preferably used. The composition further comprises preferably 1% to 50% by weight of a linear, preferably thermostable polymer.

Abstract: Thermosetting quinazolone resins, their preparation and their applications re described.These thermosetting quinazolone resins can be defined as having the following general formula: ##STR1## in which Ar.sup.1 is a bivalent mono- or polycyclic aromatic radical and Ar.sup.2 is a bivalent aromatic radical of several simple aromatic rings bound two by two by atoms or bivalent groups.These Ar.sup.1 and Ar.sup.2 radicals are chosen so that the melting or emollescence temperature is between 80.degree. C. and 170.degree. C.The resins can be prepared from condensation of an ethynylarylbenzoxazinone with an aromatic diamine containing flexibilizing groups.These quinazolone resins can be polymerized in bulk in order to prepare adhesives or composite matrices in particular.

Abstract: Oligomer compositions of polyaryloxypyridine with acetylenic end groups are btained by formation of an oligomer composition of polyaryloxypyridine with halogenated end groups from an alkaline diphenolate and a dihalogenopyridine, followed with an ethynylation reaction. The average polycondensation degree may range from 1 to 50. Theses compositions can be used to form cross-linked lattices by polyaddition of the ethynyl groups.

Abstract: The disclosed compositions of polyaryloxypyridine oligomers with phthalonile end groups are obtained by formation of a composition of polyaryloxypyridine oligomers with alkali phenolate end groups, followed with the reaction of said composition with 4-nitrophthalonitrile. Their average polycondensation degree may range from 1 to 50. They can be used in combination with a co-reactant derived from benzhydrol and containing one or two ortho-dinitrile functional groups, to constitute polyaryloxypyridine co-polyphthalocyanine lattices.

Abstract: Polyimide precursor compositions are described which may be prepared by rting a biprimary aromatic diamine with a diester-diacid or an aromatic tetraacid, and then with the substantially stoichiometrical complement of an aromatic dianhydride.The polyimide precursor compositions are used in the manufacture of insulating coatings, films, impregnating or enamelling varnishes for electric wires etc., and have excellent qualities of flexibility, adhesiveness and heat resistance.

Abstract: Aromatic polyimide compositions, precursors of copolyphthalocyanine-imides, heir manufacturing process and the resultant copolyphthalocyanine-imides, are described.These compositions may result for the reaction of 80.degree.-300.degree. C. of an aromatic tetra acid, diester-diacid, tetraester or dianhydride compound of formula: ##STR1## with an aromatic amino-dinitrile ##STR2## and optionally an aromatic diamine NH.sub.2 --Ar--NH.sub.2. A subsequent heating at 200.degree.-300.degree. C. provides, by cross-linking, copolyphthalocyanine-imides, which are hardened resins, stable at 250.degree.-300.degree. C. in continuous use.