Abstract: The present invention provides a heat dissipation film having high mechanical strength and flexibility, which is obtained by laminating a heat emission layer excellent in heat dissipation by infrared radiation, electrical insulation, and heat resistance on a metal film having excellent heat transfer efficiency. The present invention also provides a dispersion for heat emission layers for use in the production of the heat dissipation film, a method for producing a heat dissipation film using the dispersion for heat emission layers, and a solar cell including the heat dissipation film.
Type:
Application
Filed:
April 16, 2014
Publication date:
February 16, 2017
Applicants:
SUMITOMO SEIKA CHEMICALS CO., LTD., National Institute of Advanced Industrial Science and Technology, CERAMISSION CO., LTD.
Abstract: The invention provides a heat radiating sheet which is not restricted by the shape and arrangement of a part to be cooled and which can be easily manufactured. A flexible heat radiating film having the effect of radiating infrared rays is formed on the front surface of a flexible heat absorbing layer having heat conductivity, and an adhesive layer consisting of a heat conductive adhesive agent is formed on the rear surface of the absorbing layer, so that the heat radiating sheet is formed to have flexibility.
Type:
Application
Filed:
December 16, 2003
Publication date:
July 29, 2004
Applicants:
Oki Electric Industry Co., Ltd., Ceramission Co., Ltd.
Abstract: To provide a composition for easily forming a coating film that has both cooling and heat shielding properties. An emulsion composition in which a metallic oxide such as kaolin, silicon oxide, aluminum oxide or the like is included in a silicone resin emulsion is made, and this emulsion composition is coated onto a substrate such as a drive motor, or an integrated circuit, or printed circuit board or the like on which these devices are mounted, to thereby form a coating film, and the temperature of the parts and devices on which the coating film is formed is decreased, thus improving their reliability and stability.
Type:
Application
Filed:
December 16, 2003
Publication date:
July 29, 2004
Applicants:
Ceramission Co., Ltd., Oki Electric Industry Co., Ltd.