Abstract: A test socket for an IC device has relatively thin contact interface wall in which an having an array of double-ended pogo pins. The double-ended pogo pins provide resilient spring-loaded contacts for the I/O contacts of an IC device held in the socket as well as for the circuit contacts of a PC board to which the socket is mounted.

Abstract: Probe testing of an integrated circuit so as to achieve low probe needle contact resistance without probe needles “scrubbing” against bonding pads is achieved at high test signal frequencies by a probe needle assembly (14) including a plurality of probe needles (13) each having a shank portion (13A), a curved flex portion (13B), and a contact tip (13C) on a free end of the flex portion, the shank portion (13A) being electrically coupled to an electrical test system. The shank portion (13A) of each probe needle is attached to a surface (16A) of an insulative layer (16). The insulative layer is supported on a ground plane conductor 25. The flex portions (13B) of the probe needles (13) extend beyond an edge of the insulative layer. A portion (24) of the ground plane conductor (25) extends beyond the insulator (16) and is adjacent to all but an extending tip portion (30) of the flex portion (13B) of each probe needle (13).

Abstract: A cover assembly for IC chip has a lid portion and a retractable chip depressor member extendable from the underside of the lid portion along the lid's z-axis. When the cover assembly is mounted over the chip cavity of an IC socket and is properly indexed in the x-y plane of the socket, the retractable chip depressor member is retractable advanced along the z-axis of the lid portion to contact and depress the chip in the socket's chip cavity by a force that is parallel to the z-axis of the chip cavity and that is normal to the IC chip.

Abstract: A test socket for testing an optical IC device in a dead bug orientation includes a socket body with a device under test cavity (DUT cavity) for receiving an optical IC device under test (optical DUT) in a contact-up or dead bug orientation. The DUT cavity has a bottom wall with at least one aperture through which the photoactive side of the optical DUT held in the cavity can be illuminated. An outer array of axial contact elements arranged about the DUT cavity provides conductive paths through the socket body. The test socket further includes a plunger assembly insertable into the DUT cavity of the socket body having an inner array of axial contact elements which extend through the plunger assembly and which are configured to provide contact with the contacts on the contact side of the optical DUT.

Abstract: An I/C chip socket is provided with a separate docking platform having a seating surface with an array of locator openings for receiving and fixing the position of the I/O contacts of an I/C chip such as the solder balls of a BGA. The docking platform is depressibly mounted in the base portion of the socket over the tips of an array of pogo pins. The docking platform acts to precisely center the I/O contacts of the I/C chip seated thereon with the pogo pin tips.

Abstract: An improved probe tip for making electrical contact with a solder ball of an integrated circuit device such as a BGA includes two perimeter point structures having interior angled edges which form a front hollow region in the probe tip for receiving the solder ball of a BGA. Each of the interior edges of the point structures includes an angled medial contact zone which tangentially contacts the solder ball received in the hollow region of the tip to produce minimal distortion of the solder ball. The method of the invention permits electrical contact with a solder ball of a BGA with minimal deformation of the solder ball. In accordance with the method, the contact between the probe tip and the solder ball is limited to tangential contacts around the solder ball below the solder ball's apex.

Abstract: A system for interfacing between a semiconductor wafer, an automatic wafer probe machine, and an automatic IC test system includes an insert ring adapted for attachment to a support of the wafer probe machines. A lock ring assembly includes a lock ring rotatably disposed in the insert ring. A cam element having a sloped camming surface is attached to the lock ring. A retaining element attached to the insert ring retains the lock ring in the insert ring. A lid hingeably attached to the insert ring supports a POGO tower assembly including an adapter ring for attachment to a POGO tower and a z-axis ring attached to the adapter ring, and a mounting assembly connecting the z-axis ring in spring-loaded relationship to the lid. A cam follower attached to the z-axis ring engages the sloped camming surface when the lid is lowered to position a bottom surface of the POGO tower slightly above the probe card.

Abstract: A probe needle alignment device supports a probe card assembly with probe needles extending upward. A microscope includes a first eyepiece aligned with the probe needles in its field of view. A first video camera is positioned in optical alignment with the first eyepiece to view probe needles through the first eyepiece. An overdriver includes a transparent planar plate movably disposed between the microscope and the probe needles to displace contact tips of the probe needles through an overdrive distance. A mask plate has a plurality of spots located at positions corresponding precisely to positions of contact pads of an integrated circuit to be probe tested. A second video camera includes the spots within its field of view.

Abstract: A system for testing an integrated circuit on a semiconductor wafer so as to achieve low probe needle contact resistance with low probe needle force and without substantial scrubbing includes a probe and supporting a plurality of probe needles electrically coupled to an electrical test system above and in alignment with a plurality of contact pads of the integrated circuit, respectively. The wafer is mechanically moved to press probe needles to bring a tip of each probe needle into physical contact with a corresponding contact pad, and is further moved to increase a needle force of each tip against the corresponding contact pad and cause flexing of a curved portion of each probe needle. Each probe needle is curved such that the flexing causes the tip of each probe needle to rock without appreciable sliding on the surface of the contact pad.

Abstract: A probe card assembly includes a probe card, an interposer and a probe array. The probe array includes a plurality of closely spaced pins, each pin includes a post and a beam, and each beam has a first end attached to the top of a post and a second end for contacting an integrated circuit. A bead on the second end of the beam assures that the free end of the beam will contact an IC first. For contacts on a grid, the beams extend diagonally relative to the rows and columns of the grid, enabling the beams to be longer. For contacts in a row on centers closer than the pins, two rows of pins straddle the contacts and the beams extend toward the contacts from opposite sides of the contacts. The probe array can be formed on the high density side of the interposer.

Abstract: A probe card formed of a printed circuit board having an opening therein and having a ground plane formed on the lower surface thereof. A ground strip formed of aluminum is secured to the printed circuit board and positioned adjacent the opening and in electrical contact with the ground plane. The strip includes a support surface for supporting a plurality of probes extending along and parallel to the surface and secured thereto by insulating means to maintain a predetermined distance from the support surface. The probes extend into the opening for making temporary electrical contact with a circuit to be tested.

Abstract: A probe assembly is described for providing temporary connection to electrical circuits under test such as integrated circuits and the like. Individual probes are formed of suitable metal and are provided with a 90.degree. bend to create a depending portion for contact with a pad of a circuit under test and to form a supported length extending along a slot formed in the surface of a probe guide. The slot in the probe guide terminates at a hole for receiving the depending portion of the probe; the probe is supported by and positioned by the probe guide within the slot and hole provided therefore; an elastomeric pad is placed over a portion of the probe in the slot and a pressure plate urges the elastomer into contact with the probe to provide biasing force to urge the probe to extend through the probe guide hole into contact with the pad of the circuit under test.

Abstract: A probe device for testing integrated circuit wafers is disclosed. The probe device comprises a support means, which has metallized portions, and an aperture. A plurality of "L" shaped holding means, each having a thin metallized surface, are coupled to metallized portions of the support means so that a portion of the holding means extends into the aperture. Coupled to the metallized surface of each of the holding means is a corresponding needle-like probe member which has a curved portion. These probe members are coupled to the holding means in such a manner that their curved portions extend into the support means aperture so as to electrically contact a circuit wafer placed therein, and thereby electrically couple the circuit wafer to the support means, and ultimately to circuit testing apparatus.