Abstract: The present invention relates to a device for gripping a flat structure with openings in the area of its upper side, in particular a honeycomb structure, comprising two gripper units spaced apart from each other in a length direction, each of which in turn comprises at least one pin, and at least one pin displacement unit which is adapted to displace the at least one pin in an extending direction, as well as a tilting unit which is adapted to tilt at least one of the gripper units about a tilting axis extending substantially in a width direction. The invention also relates to a method for gripping a flat structure by means of such a device.

Abstract: Laying die includes an attaching element having an inlet port for receiving positively pressurized gas; and a carrier body made from an elastically deformable material and attached on a lower side of the attaching element. The carrier body includes passages enabling a gas flow between the attaching element and the lower side of the carrier body opposed to the attaching element. The attaching element houses a flow path arranged to receive pressurized gas from the inlet port and a longitudinal pathway extending from the lower side of the attaching element towards an upper side of the attaching element. The flow path discharges into the longitudinal pathway at a junction section, which is arranged such that pressurized gas discharging into the longitudinal pathway creates a negative pressure and comprises a curved deflection surface curved towards the upper side of the attaching element.