Abstract: A method for manufacturing an intraocular retinal implant including: providing a mold capable of supporting growth of a layer of doped diamond, the mold including, on one face, elements all depressed or all projecting with respect to the surface of the face, and constituting a pattern cavity for the electrodes of the implant which it is desired to obtain; producing the doped diamond electrodes by growing a layer of doped diamond in all or part of a space occupied by the pattern cavity elements; forming a first insulating layer on the face of the mold including the pattern cavity; producing interconnection lines by depositing an electrically conductive material at least in spaces not covered by the first insulating layer; forming a second insulating layer on the mold face including the pattern cavity, the second layer covering the interconnection lines, the first and second insulating layers forming a flexible plate of the implant; removing the mold.
Type:
Grant
Filed:
June 8, 2011
Date of Patent:
August 12, 2014
Assignees:
Commissariat a l'energie atomique et aux energies alternatives, Chambre de Commerce et d'Industrie de Paris (ESIEE Paris)
Inventors:
Emmanuel Scorsone, Philippe Bergonzo, Gaelle Lissorgues, Lionel Rousseau, Michel Bonnauron, Christine Alice Regine Helene Terrades, Serge Anne Daniel Bonnauron, Lucas Claude Jean Francois Bonnauron, Tanguy Richard Yves Bonnauron
Abstract: A method for manufacturing an intraocular retinal implant including: providing a mold capable of supporting growth of a layer of doped diamond, the mold including, on one face, elements all depressed or all projecting with respect to the surface of the face, and constituting a pattern cavity for the electrodes of the implant which it is desired to obtain; producing the doped diamond electrodes by growing a layer of doped diamond in all or part of a space occupied by the pattern cavity elements; forming a first insulating layer on the face of the mold including the pattern cavity; producing interconnection lines by depositing an electrically conductive material at least in spaces not covered by the first insulating layer; forming a second insulating layer on the mold face including the pattern cavity, the second layer covering the interconnection lines, the first and second insulating layers forming a flexible plate of the implant; removing the mold.
Type:
Application
Filed:
June 8, 2011
Publication date:
September 5, 2013
Applicants:
Chambre de Commerce et d'Industrie de Paris (ESIEE PARIS), Commissariat a l'energie atomeique et aux energies alternatives
Inventors:
Emmanuel Scorsone, Philippe Bergonzo, Mathias Bonnauron
Abstract: Method for the embodiment of a flat active matrix screen and a RAM memory using MIM components.The method of the invention includes the following operations:a stacking is formed of a first material, namely an oxidizing conductor, and a second material, namely an oxidizable conductor and preferably a semiconductor,this stacking is heated to a temperature suitable for provoking an oxidation-reduction between the two materials, which forms an interposed insulating film,this stacking is cooled to ambient temperature.Application for electronics concerning the embodiment of active matrix liquid crystals display screens or dynamic RAM memories.
Type:
Grant
Filed:
December 21, 1989
Date of Patent:
February 4, 1992
Assignee:
Chambre de Commerce et d'Industrie de Paris