Abstract: A system and a method for treating salt-containing glycerin wastewater are provided, wherein the system for treating the salt-containing glycerin wastewater includes a mixing tank, a filtering device, a distillation column, and a water supply device. The mixing tank is adapted to mix salt-containing glycerin wastewater with a concentrated hydrochloric acid to obtain a mixture. The filtering device communicates with the mixing tank and filters the mixture to obtain an acidic filtrate and a precipitated salt. The distillation column communicates with the filtering device and receives the acidic filtrate from the filtering device. The water supply device supplies water to the acidic filtrate. The system and method for treating the salt-containing glycerin wastewater can effectively recycle hydrochloric acid.

Abstract: The present disclosure relates to a copper foil that exhibits surprising low repulsive force characteristics; and to methods for manufacturing such copper foils. Typically, the copper foil has (a) a lightness L* value of the nodule untreated side, based on the L*a*b color system, in the range of 75 to 90 and (b) a normal tensile strength in the range of 40 kgf/mm2 to 55 kgf/mm2. The disclosure further relates to flexible printed circuit boards and electronic devices using the above-mentioned copper foils for forming conductive lines therein.

Abstract: The present disclosure relates to a copper foil that exhibits surprising low repulsive force characteristics; and to methods for manufacturing such copper foils. Typically, the copper foil has (a) a lightness L* value of the nodule untreated side, based on the L*a*b color system, in the range of 75 to 90 and (b) a normal tensile strength in the range of 40 kgf/mm2 to 55 kgf/mm2. The disclosure further relates to flexible printed circuit boards and electronic devices using the above-mentioned copper foils for forming conductive lines therein.

Abstract: The present disclosure relates to a copper foil that exhibits surprising low repulsive force characteristics; and to methods for manufacturing such copper foils. Typically, the copper foil has (a) a lightness L* value of the nodule untreated side, based on the L*a*b color system, in the range of 75 to 90 and (b) a normal tensile strength in the range of 40 kgf/mm2 to 55 kgf/mm2. The disclosure further relates to flexible printed circuit boards and electronic devices using the above-mentioned copper foils for forming conductive lines therein.

Abstract: A method and production of composite foils and thin copper foils peeled from said composite copper foils is disclosed for use in forming printed circuit boards (PCB). Either the composite foil or only the thin copper foil can be laminated to a polymer layer to form the printed circuit board, with the step of separating the thin copper foil from the composite copper foil is performed subsequent to said laminating step.

Abstract: A butanol expression cassette includes a butanol production related genes and a fermentation regulatory element. The fermentation regulatory element controls the expression of the butanol production related gene and locates upstream of the butanol production related gene. The fermentation regulatory element includes a promoter, a ribosome binding site and a transcription factor binding site of a fermentation gene. A fermentation in which the fermentation regulatory element involves includes an acetic acid fermentation, an alcohol fermentation, a succinic acid fermentation or a lactic acid fermentation, the butanol production related gene is not the fermentation gene or a gene of an upstream product of the fermentation in which the fermentation gene involves. The present invention provides a recombinant plasmid formed by cloning the butanol expression cassettes in the expression vector.

Abstract: A Cas9 expression plasmid, a genome editing system and a genome editing method for Escherichia coli are provided. The Cas9 expression plasmid includes a tracrRNA sequence, a Cas9 gene and a chloramphenicol resistance gene (CmR). The Cas9 expression plasmid is applied to CRISPR/Cas-coupled ?-red recombineering system for editing genomes of E. coli with high efficiency.

Abstract: The present disclosure relates to a multilayer carrier foil, a core structure formed using the multilayer carrier foil, printed circuit boards, and electronic devices. The multilayer carrier foil comprises: (a) a copper carrier layer having a release side and a laminate side, the laminate side of carrier layer optionally having nodules; (b) a chromium release layer applied to the copper carrier layer; (c) an intermediate copper layer applied to the chromium release layer; (d) an anti-migration layer applied to the intermediate copper layer of (c); and (e) an ultra-thin copper layer applied to the anti-migration layer of (d). The disclosure further relates to methods of making the multi-layer carrier foil, the core structure, and printed circuit boards.

Abstract: A copper foil having a matte side with nickel plated thereon in an amount of nickel in the range of 100,000-300,000 ?s/dm2. The plated copper foils have particular utility in Positive Temperature Coefficient (PTC) devices. The plated copper foils have a surface hardness of from 50 to 200, a tensile strength greater than 45 kg/mm2 and a shiny side surface roughness (Rz) not exceeding 2.0 ?m. The surface roughness of the matte side of the copper foil is in the range of 6 to 10 ?m. Copper nodules are present on the matte side of the copper foil between the copper foil and the nickel plating. Methods of producing the copper foil and PTC devices incorporating the copper foil are described.

Abstract: The present disclosure relates to an improved electrodeposited copper foil having uniform thickness and methods for manufacturing the electrodeposited copper foil. The electrodeposited copper foil typically has one to four interfacial lines through the cross-sectional area of the foil and a weight deviation less than 2.0%. The disclosure also relates to a process for making the electrodeposited copper foil that includes the addition of one or more insulative masks to the surface of a dimensionally stable anode. The insulative mask is cut to correspond to areas of variation in electrodeposited copper foil, such that the mask causes interferences with the electrodeposition process to even out the variation.

Abstract: A method of producing a composite heat dissipating structure by depositing a slurry of graphene particles upon a copper foil, drying the slurry to form a layer of graphene in contact with the copper foil, and consolidating the layer of graphene under pressure to reduce the thickness of the graphene layer and recovering the composite heat dissipating structure. Heat dissipating copper foils and composite heat dissipating structures and electronic devices incorporating the same are also disclosed herein.

Abstract: Disclosed are novel copper foils used as components of wireless charging systems. The copper foils can be laminated to produce flexible copper clad laminates, which can then be etched to form printed circuits (coils). The coils can be used as either, or both, of a receiver wireless charging circuit and/or a transmitter wireless charging circuit. Regulation of the chemical and physical properties of the copper foil produces higher efficiencies in the wireless charging system components.

Abstract: The present disclosure relates to a surface-treated copper foil which exhibits excellent affinity for an active material layer that is applied to the copper foil in the manufacture of a negative electrode (anode), for use in secondary lithium-ion batteries. The copper foil is plated with chromium and zinc and subsequently subjected to an organic treatment. The surface-treated copper has a surface tension of 34 to 58 dyne/cm and a surface roughness (Rz) of 0.8 to 2.5 ?m, and comprises: (a) copper foil; (b) a zinc-chromium layer plated one or both sides of the copper foil, wherein the zinc content in the zinc-chromium layer is from 10 to 120 ?g/dm2 and the chromium content in the zinc-chromium layer is from 10 to 35 ?g/dm2; and (c) an organic hydrophobic layer applied to the zinc-chromium layer.

Abstract: An electrodeposited copper foil having a texture coefficient of a plane (200) from 50 to 80%, based on the sum of the texture coefficients of a plane (111), the plane (200), a plane (220) and a plane (200) of the electrodeposited copper foil is provided. The electrodeposited copper foil is particularly suitable for use in the applications in printed circuit boards and lithium ion secondary batteries.

Abstract: A method for producing alkylphenol is provided. The method includes charging phenol and an olefinic compound into a reaction zone of a reactive distillation tower for a reaction; and separating a product stream containing alkylphenol from the reactive distillation tower, wherein the boiling point of the olefinic compound is lower than that of the phenol, and the phenol is charged into the reactive distillation tower at a charging position located above a position for charging the olefinic compound.

Abstract: A method for producing alkylphenol is provided. The method includes charging phenol and an olefinic compound into a reaction zone of a reactive distillation tower for a reaction; and separating a product stream containing alkylphenol from the reactive distillation tower, wherein the boiling point of the olefinic compound is lower than that of the phenol, and the phenol is charged into the reactive distillation tower at a charging position located above a position for charging the olefinic compound.

Abstract: The present disclosure relates to a copper foil which exhibits surprising anti-deformation properties (e.g., it is resistant to swelling, sagging, and wrinkling). Typically, the copper foil has (a) a shiny side with a surface roughness (Rz) in the range of 0.6 to 1.9 ?m; (b) a matte side with a surface roughness (Rz) in the range of 0.6 to 1.9 ?m; and (c) a lightness L* value of the matte side, based on the L*a*b* color system, in the range of 12 to 35. The disclosure further relates to an anode comprising an anode active material on an anode current collector, wherein the anode current collector includes the above-mentioned copper foil. The anodes are used in, for example, lithium ion secondary batteries.

Abstract: An electrolytic copper foil includes a copper foil body; and a IIA-group metal adhered to a surface of the copper foil body, wherein a signal strength of the IIA group metal is greater than 0.1% based on a signal strength of copper element as 100% analyzed by a secondary ion mass spectrometer. The present invention also provides a method for cleaning copper foil and a cleaning fluid composition which is used in the cleaning method.

Abstract: The present invention provides a method for producing a porous copper foil. The method of the present invention includes the steps of forming an oxide film by providing a chromium-containing compound to a metal surface of a cathode; forming a copper foil on the oxide film by performing electrolysis of copper; and removing the copper foil from the metal surface of the cathode. The method of the present invention is simple and time-saving, and the porous copper foil of the present invention has reduced roughness difference between both sides of the porous copper foil.

Abstract: An electrolytic copper foil is provided. The electrolytic copper foil has a shiny side and a matte side opposing to the shiny side, wherein the difference in roughness between the shiny side and the matte side is 0.5 ?m or less. The electrolytic copper foil has a tensile strength of 45 kg/mm2 or above, and is particularly suitable for applications in a lithium ion secondary battery.