Abstract: The Phosphorus-containing bisphenols and preparing method thereof are disclosed. A method for producing the phosphorus-containing bisphenol of the formula (1) includes reacting compounds respectively defined by a formula (a), (b), (c) and an acid catalyst to yield compounds of phosphorus-containing bisphenol.
Type:
Grant
Filed:
July 14, 2009
Date of Patent:
March 13, 2012
Assignees:
National Chunghsing University, Chang Chun Plastics Co., Ltd
Abstract: The present invention relates to a water soluble photosensitive polyimide polymer, preparation thereof and a photoresist composition containing the same. The water soluble photosensitive polyimide polymer is characterized by having repeat units represented by the following formula (I): the other symbols are defined in the specification].
Type:
Grant
Filed:
April 10, 2009
Date of Patent:
December 27, 2011
Assignee:
Chang Chun Plastics Co., Ltd.
Inventors:
Jen Fu Wang, Sheng Yen Wu, An Pang Tu, Kuen Yuan Hwang
Abstract: The present invention provides a phosphorus-containing compound of formula (I): wherein R1, R2, R3 and R4 are the same or different; and R1, R2, R3 and R4 are independently selected from the group consisting of hydrogen, halogen, C1-8 alkyl, haloalkyl, and alkoxy. The phosphorus-containing compound is prepared by bonding a bisphenol group to a phosphorus atom to prevent the phosphorus-containing heterocyclic molecule from exhibiting steric hindrance on hydroxyl functional groups, thereby increasing reactivity in the subsequent reactions.
Type:
Grant
Filed:
October 7, 2009
Date of Patent:
August 9, 2011
Assignee:
Chang Chun Plastic Co., Ltd.
Inventors:
Gai-Chi Chen, Ching-Jui Huang, An Pang Tu, Kuen Yuan Hwang
Abstract: A phosphorus-containing epoxy resin and a method for synthesizing the same are disclosed. The method includes the step of catalytically reacting compound (i) with compound (ii) to synthesize the phosphorus-containing epoxy resin having the structure of compound (I). R is methyl or phenyl, and n is the integer from 1 to 9.
Abstract: A polyimide resin composition modified with bismaleimide and cyanate, which comprises (a) polyimide resin, (b) cyanate, (c) bismalemide, and (d) nanometer filler. By using the present polyimide resin composition modified with bismalemide and cyanate, heat expansion coefficient of polyimide can be reduced. Also, heat resistance and dimension stability of the polyimide resin can be improved, and thus it is suitable for cladding with copper foil to produce printed circuit board.
Type:
Grant
Filed:
May 10, 2007
Date of Patent:
October 19, 2010
Assignee:
Chang Chun Plastics Co., Ltd.
Inventors:
Kuen Yuan Hwang, An Pang Tu, Sheng Yen Wu
Abstract: The present invention provides a phosphorus compound of formula (I). The phosphorus compound is prepared by reacting a compound of formula (II) with alkylene carbonate. As compared with the conventional phosphorus compounds as flame-resistant additives, the phosphorus compound of the present invention has not only a high pyrolysis temperature but also excellent solubility in most of the organic solvents with high or low polarity, and is therefore a suitable flame-resistant additive for use in thermosetting or thermoplastic resins.
Type:
Application
Filed:
November 3, 2009
Publication date:
May 20, 2010
Applicant:
CHANG CHUN PLASTIC CO., LTD.
Inventors:
I-Cheng Hsu, Ping-Chieh Wang, An- Pang Tu, Kuen-Yuan Hwang
Abstract: The present invention provides a phosphorus-containing compound of formula (I): wherein R1, R2, R3 and R4 are the same or different; and R1, R2, R3 and R4 are independently selected from the group consisting of hydrogen, halogen, C1-8 alkyl, haloalkyl, and alkoxy. The phosphorus-containing compound is prepared by bonding a bisphenol group to a phosphorus atom to prevent the phosphorus-containing heterocyclic molecule from exhibiting steric hindrance on hydroxyl functional groups, thereby increasing reactivity in the subsequent reactions.
Type:
Application
Filed:
October 7, 2009
Publication date:
April 29, 2010
Applicant:
CHANG CHUN PLASTICS CO., LTD.
Inventors:
Gai-Chi Chen, Ching-Jui Huang, An Pang Tu, Kuen Yuan Hwang
Abstract: The present invention relates to all-aromatic polyesters, a method for preparing the same, and a polyester composition containing the same. The present method is carried out in two stages of first carrying out a prepolymerization to obtain a prepolymer having a specific particle size distribution, then carrying out a solid polymerization. The present method can control the quality of polyester effectively and produce all-aromatic polyester exhibiting excellent flowability, high heat resistance, and high solder heat resistance.
Type:
Grant
Filed:
March 19, 2007
Date of Patent:
February 16, 2010
Assignee:
Chang Chun Plastics Co., Ltd
Inventors:
Kuen Yuan Hwang, An Pang Tu, Chih Fu Chen, Jia Sheng Liau
Abstract: A phenolic resin having not more than 5 wt% of free bisphenol and a molecular weight distribution Mw/Mn of not more than 2.0 is prepared by reacting a bisphenol and aldehyde in the presence of an alkaline catalyst at a temperature of from 0° C. to 100° C., neutralizing with an acid, adding an acid to adjust the pH to from 0 to 6, heating to a temperature of from 50° C. to 200° C, and vacuuming to recover the phenolic resin.
Type:
Grant
Filed:
November 9, 2006
Date of Patent:
February 16, 2010
Assignee:
Chang Chun Plastics Co., Ltd.
Inventors:
Kuen Yuan Hwang, An Pang Tu, Chun Hsiung Kao, Fang Shian Su
Abstract: The Phosphorus-containing bisphenols and preparing method thereof are disclosed. A method for producing the phosphorus-containing bisphenol of the general formula (1) includes reacting compounds respectively defined by a general formula (a), (b), (c) and an acid catalyst to yield compounds of phosphorus-containing bisphenol.
Type:
Application
Filed:
July 14, 2009
Publication date:
January 21, 2010
Applicants:
NATIONAL CHUNGHSING UNIVERSITY, CHANG CHUN PLASTICS CO., LTD
Abstract: The present invention relates to a flame-retarding epoxy resin composition containing no halogen, which comprises an epoxy resin containing no halogen, a toughening agent, and a flame retarding agent. The present flame-retarding epoxy resin composition exhibits a high heat-resistance and excellent adhesion and is useful as adhesive agent in flexible printed circuit board.
Type:
Grant
Filed:
January 27, 2006
Date of Patent:
July 28, 2009
Assignee:
Chang Chun Plastics Co., Ltd.
Inventors:
Kuen Yuan Hwang, An Pang Tu, Sheng Yen Wu, Yu Lin Huang
Abstract: The present invention provides phosphorus-based oxazine compounds and the preparation method thereof. The phosphorus-based oxazine compounds of the present invention can provide better fire-resistant characteristics, while the preparation method for the phosphorus-based oxazine compound of the present invention can offer high yields and/or high purity phosphorus-based oxazine compounds.
Type:
Grant
Filed:
January 21, 2008
Date of Patent:
July 28, 2009
Assignees:
Chang Chun Plastics Co., Ltd., National Chung Hsing University
Abstract: The present invention provides phosphorus-based oxazine compounds and the preparation method thereof. The phosphorus-based oxazine compounds of the present invention can provide better fire-resistant characteristics, while the preparation method for the phosphorus-based oxazine compound of the present invention can offer high yields and/or high purity phosphorus-based oxazine compounds.
Type:
Application
Filed:
January 21, 2008
Publication date:
July 2, 2009
Applicants:
CHANG CHUN PLASTICS CO., LTD., NATIONAL CHUNG HSING UNIVERSITY
Abstract: The present invention relates to a method for preparing amino phosphate flame retardants. Melamine and phosphoric acid substances are used as a starting material, AND then the starting material reacts in the absence of solvents at a temperature ranging from 40 to 200° C. to obtain powdery amino phosphate compounds used as flame retardants. Since the reaction free of solvents is carried out under a condition of lower temperature, the powdery amino phosphate compounds can be obtained without drying steps. Therefore, not only the contaminations caused by solvent volatilization can be avoided, but also the process of preparing the product is simplified and the cost of the product is reduced.
Abstract: The present invention relates to an ultraviolet curable resin of the present invention which is prepared from alkyl(meth)acrylates, glycidyl(meth)acrylate, and substituted or unsubstituted acrylic acid, wherein the resin contains terminal vinyl group in amount of at least 50 wt % based on the resin and its glass transition temperature (Tg) is in a range of from 40˜100° C. The present invention also relates to a resin composition containing the ultraviolet curable resin.
Type:
Application
Filed:
August 16, 2007
Publication date:
November 6, 2008
Applicant:
CHANG CHUN PLASTICS CO., LTD.
Inventors:
Kuen-Yuan Hwang, An-Pang Tu, Ping-Chieh Wang, Chie-Wei Yang
Abstract: A flame resistant resin composition is provided, which includes: (A) at least an epoxy resin having a biphenylic unit or a naphthalenic unit; (B) phenolic resins used as a curing agent, the phenolic resins include at least a phenolic resin having a biphenylic moiety and a polyphenolic moiety, wherein the the at least a phenolic resin having a biphenylic moiety and a polyphenolic moiety is in an amount of 30 to 100 wt % of the total weight of the curing agents; (C) a curing-promoting agent; and (D) an inorganic filler material. The resin composition includes an epoxy resin having a biphenylic unit or a naphthalenic unit and the phenolic resin having a biphenylic moiety and a polyphenolic moiety as a curing agent, such that excellent flame resistance can be achieved without adding flame resistant agents. The resin composition also has a higher glass transition temperature to improve the water absorption issue after curing, and increases heat stability.
Abstract: A method for producing a melamine salt of bis(pentaerythritol phosphate) phosphoric acid is proposed. The method includes the steps of reacting and mixing pentaerythritol and diphosphorous pentaoxide in an extruder to carry out esterification to produce bis(pentaerythritol phosphate) phosphoric acid; and mixing bis(pentaerythritol phosphate) phosphoric acid with melamine or a derivative thereof to carry out quaternization in the presence of a solvent, followed by removing water to obtain a melamine salt of bis(pentaerythritol phosphate) phosphoric acid. Diphosphorous pentaoxide is used in the method as a reactant, so that no hydrogen chloride is produced and it is not necessary to recollect trichlorophosphoric acid. Moreover, in the method of the present invention, such that esterification time can be shortened and a high pressure in a closed reaction system that causes explosion can be avoided.
Abstract: Provided an industrially excellent method of producing a phenol novolak resin having an ortho ratio of 30% or more by: (1) a method of reacting a phenol and an aldehyde using an oxalic acid catalyst at 110 to 160° C. under pressure; or (2) a method of reacting a phenol and an aldehyde under pressure while removing the heat of reaction by a condenser with controlling a pressure so that water or an organic solvent present in the reaction system is refluxed.
Abstract: A nonflammable resin composition comprises (A) at least an epoxy resin with biphenyl unit or naphthyl unit; (B) at least a phenolic resin used as a hardener, wherein the phenolic resin has a skeleton formed by phenyl rings bonding directly each other without interruption, and is in an amount of 30 to 100% by weight based on total hardeners; and (C) a curing catalyst. The said nonflammable resin has an excellent flame retardancy, a good heat resistance, and an improved moldability and reliability.
Abstract: This invention relates to a negative photoresist composition with multi-reaction models. When the photoresist composition according to the present invention is used in photolithography processes employing UV light to produce cross-link reactions and multi-reactions including radical polymerization and cationic polymerization also occur. The photoresist composition can be used to control light reaction efficiency and increase reaction thoroughness, thus obtaining a high resolution pattern.
Type:
Grant
Filed:
November 24, 2003
Date of Patent:
March 4, 2008
Assignees:
Industrial Technology Research Institute, Chang-Chun Plastics Co., Ltd.