Patents Assigned to Chang Sheng Hsiang Chang
  • Inorganic packaging module having a chip encapsulated therein
    Patent number: 10636718
    Abstract: A packaging module includes a substrate, a chip firmly mounted on the substrate, a frame firmly connected to the substrate via a gold-to-gold bonding and a cover firmly connected to the frame via the same gold-to-gold bonding. With the inorganic bonding structure, the packaging module is able to endure high temperature and high pressure without the worry of bonding agent being damaged by environmental condition change.
    Type: Grant
    Filed: September 21, 2018
    Date of Patent: April 28, 2020
    Assignee: Chang Sheng Hsiang Chang
    Inventor: Sheng Hsiang Chang