Abstract: Disclosed is a method of manufacturing a multilayered chip power inductor by forming a laminate body having upper and lower sides by laminating magnetic sheets, forming an inner hollow by punching out a middle part of said laminate body, inserting a magnetic core into the inner hollow, where an electrical conductive coil is wound into said inner hollow, laminating a first copper clad magnetic sheet onto the upper and lower sides of said laminate body having the magnetic core in the inner hollow as a land layer having upper and lower sides, forming a land by etching said land layer, forming a hole by drilling the land, plating the hole formed in the land, laminating a second copper clad magnetic sheet as a terminal layer onto upper and lower sides of the land layer having the land, forming a terminal by etching the terminal layer, forming a hole by drilling the terminal, and plating the hole.

Abstract: The present invention relates to a multilayered chip power inductor with high direct current superposition characteristics and high-frequency characteristics, particularly to a multilayered chip power inductor using as magnetic materials a magnetic sheet filled up with soft magnetic metal powder and a magnetic core. The present invention is to provide a multilayered chip power inductor achieving high inductance and direct current superposition characteristics.

Abstract: The present invention relates to a multilayered chip power inductor with high direct current superposition characteristics and high-frequency characteristics, particularly to a multilayered chip power inductor using as magnetic materials a magnetic sheet filled up with soft magnetic metal powder and a magnetic core. The present invention is to provide a multilayered chip power inductor achieving high inductance and direct current superposition characteristics.

Abstract: The present invention relates to a multilayer power inductor in which sheets are charged with a soft magnetic metal alloy powder having a shape optimized along a magnetic path, pattern circuits made from conductive materials are formed on the sheets, and via holes are formed through the sheets to easily connect pattern circuits. The power inductor of the present invention is manufactured by stacking the above-described sheets into multiple layers. The sheets of the inductor of the present invention are charged with soft magnetic metal powder having a high magnetization density, and fine gaps are distributed among the powder the shape of which is optimized along a magnetic path to ensure high current superposition characteristics which allow the use of 1A to several tens of A without causing leakage flux, and ensure stable inductance to a high frequency domain of the 10 MHz band.