Abstract: The present invention is directed to aqueous cleaning concentrates such as for cleaning electronic circuit assemblies comprising 15-30 wt. % of a composition containing alkaline salt, an alkali metal silicate to boost detersive action or to provide corrosion protection to the substrates which are cleaned, an anionic polymer comprising a high molecular weight polyacrylic acid which stabilizes the alkali metal silicate to prevent precipitation of the silicate from solution, surfactants, and a hydrotrope to maintain the surfactants in solution and the balance water.