Abstract: A new apparatus is provided that can be applied to clean outer edges of semiconductor substrates. Under the first embodiment of the invention, a brush is mounted on the surface of the substrate around the periphery of the substrate, chemicals are fed to the surface that is being cleaned by means of a hollow core on which the cleaning brush is mounted. The surface that is being cleaned rotates at a relatively high speed thereby causing the chemicals that are deposited on this surface (by the brush) to remain in the edge of the surface. Under the second embodiment of the invention, a porous roller is mounted between a chemical reservoir and the surface that is being cleaned, the surface that is being cleaned rotates at a relatively high speed. The chemicals that are deposited by the interfacing porous roller onto the surface that is being cleaned therefore remain at the edge of this surface thereby causing optimum cleaning action of the edge of the surface.

Abstract: A Metal Oxide Semiconductor Field Effect Transistor (MOSFET) with limited susceptibility to Hot Carrier Effects (HCEs), and a method by which that MOSFET is formed. There is first provided a semiconductor substrate which has a first portion, a second portion adjoining a side of the first portion and a third portion adjoining an opposite side of the first portion. Formed upon the first portion of the semiconductor substrate is a gate oxide layer which has a gate electrode formed and aligned thereupon. The gate electrode has a first sidewall adjoining the second portion of the semiconductor substrate and a second sidewall adjoining the third portion of the semiconductor substrate. Formed upon the first sidewall of the gate electrode and upon the surface of the second portion of the semiconductor substrate adjoining the first sidewall is a conformal oxide layer. The conformal oxide layer has a dose of fluorine atoms incorporated therein.