Patents Assigned to Cheil Industries Inc.
  • Positive photosensitive resin composition
    Patent number: 9256118
    Abstract: Disclosed is a positive photosensitive resin composition that includes (A) an alkali soluble resin selected from a polybenzoxazole precursor, a polyimide precursor, and a combination thereof, (B) a photosensitive diazoquinone compound, (C) a phenol compound, (D) an organic dye and (E) a solvent, wherein the organic dye (D) includes at least one red dye having an absorption wavelength of 590 to 700 nm, at least one yellow dye having an absorption wavelength of 550 to 590 nm, and at least one blue dye having an absorption wavelength of 450 to 500 nm.
    Type: Grant
    Filed: July 17, 2012
    Date of Patent: February 9, 2016
    Assignee: Cheil Industries Inc.
    Inventors: Ji-Yun Kwon, Jong-Hwa Lee, Hyun-Yong Cho, Dae-Yun Kim, Sang-Kyeon Kim, Sang-Kyun Kim, Sang-Soo Kim, Eun-Kyung Yoon, Jun-Ho Lee, Jin-Young Lee, Hwan-Sung Cheon, Chung-Beom Hong, Eun-Ha Hwang
  • Oxetane-cyclic epoxy compound, method of preparing the same, and composite sheet for display substrate including the same
    Patent number: 9249126
    Abstract: An oxetane-cyclic epoxy compound represented by Formula 1: where R1 is hydrogen, a methyl group or an ethyl group.
    Type: Grant
    Filed: April 27, 2012
    Date of Patent: February 2, 2016
    Assignees: CHEIL INDUSTRIES, INC., KOREA INSTITUTE OF INDUSTRIAL TECHNOLOGY
    Inventors: Young Kwon Kim, Sang Keol Lee, Tae Ho Kim, Woo Jin Lee, Sung Kook Kim, Hyun Ae Jeon, Yun Joo Kim, Sang Yong Tak, Suk Yeon Park, Kyung Nam Kang
  • Adhesive composition for polarizer plate, polarizer plate including adhesive layer including the same, and optical display including the same
    Patent number: 9250370
    Abstract: An adhesive composition for a polarizer plate, the adhesive composition including a (meth)acrylic copolymer and a polyisocyanate curing agent containing an isocyanurate structure.
    Type: Grant
    Filed: September 13, 2012
    Date of Patent: February 2, 2016
    Assignee: CHEIL INDUSTRIES, INC.
    Inventors: Yi Eun Kim, Woo Jin Jeong, Hae Ryong Chung
  • Semiconductor device connected by anisotropic conductive film
    Patent number: 9252117
    Abstract: A semiconductor device connected by an anisotropic conductive film, the film having a storage modulus of 100 MPa to 300 MPa at 40° C. after curing of the film, and a peak point of 80° C. to 90° C. in a DSC (Differential Scanning calorimeter) profile of the film.
    Type: Grant
    Filed: November 6, 2013
    Date of Patent: February 2, 2016
    Assignee: CHEIL INDUSTRIES, INC.
    Inventors: Kyoung Hun Shin, Kyu Bong Kim, Hyun Joo Seo, Young Ju Shin, Woo Jun Lim
  • Black photosensitive resin composition and light blocking layer using the same
    Patent number: 9250520
    Abstract: Disclosed are a black photosensitive resin composition including (A) a binder resin; (B) a colorant including a pigment and a silica nanoparticle; (C) a photopolymerizable compound; (D) a photopolymerization initiator; and (E) a solvent, wherein the silica nanoparticle is included in an amount of about 1 part by weight to about 11 parts by weight based on about 100 parts by weight of the pigment, and a light blocking layer and a color filter using the same.
    Type: Grant
    Filed: May 16, 2014
    Date of Patent: February 2, 2016
    Assignee: Cheil Industries Inc.
    Inventors: Hyun-Moo Choi, Arum Yu, Ho-Jeong Paek, Chang-Min Lee, Seung-Jib Choi
  • Resin composition and article using the same
    Patent number: 9249330
    Abstract: A resin composition includes a thermoplastic resin and a metal-resin composite particle, wherein the metal-resin composite particle includes a metal deposition layer, a first coating layer positioned on one side of the metal deposition layer, and a second coating layer positioned on the other side of the metal deposition layer, and the first coating layer and second coating layer include a thermosetting resin respectively. An article includes the resin composition.
    Type: Grant
    Filed: April 29, 2013
    Date of Patent: February 2, 2016
    Assignee: Cheil Industries Inc.
    Inventors: Young-Sin Kim, Kang-Yeol Park, Young-Chul Kwon
  • Compound for organic optoelectronic device, organic light emitting diode including the same and display device including the organic light emitting diode
    Patent number: 9246107
    Abstract: A compound for an organic optoelectronic device, an organic light emitting diode, and a display device, the compound including moieties represented by the following Chemical Formula 1; Chemical Formula 4; and one of Chemical Formulae 2 and 3;
    Type: Grant
    Filed: November 3, 2011
    Date of Patent: January 26, 2016
    Assignee: CHEIL INDUSTRIES, INC.
    Inventors: Kyoung-Mi Lee, Sung-Hyun Jung, Dong-Wan Ryu, Seung-Min Lee, Hyon-Gyu Lee, Mi-Young Chae, Dal-Ho Huh, Jin-Seok Hong
  • Composition for hardmask, method of forming patterns using the same, and semiconductor integrated circuit device including the patterns
    Patent number: 9244351
    Abstract: A composition for a hardmask including copolymer including repeating units represented by Chemical Formulae 1 and 2 and a solvent, a method of forming a pattern using the same, and a semiconductor integrated circuit device including a pattern formed using the method are provided.
    Type: Grant
    Filed: November 23, 2012
    Date of Patent: January 26, 2016
    Assignee: CHEIL INDUSTRIES, INC.
    Inventors: Sung-Jae Lee, Joon-Young Moon, Youn-Jin Cho, Young-Min Kim, Yong-Woon Yoon
  • Adhesive composition and optical member using the same
    Patent number: 9243168
    Abstract: An adhesive composition and an optical member using the same, the adhesive composition including about 100 parts by weight of a (meth)acrylate copolymer including repeating units derived from a C1-20 alkyl(meth)acrylate monomer, an aromatic group-containing monomer, and a carboxyl group-containing monomer; about 0.01 to about 10 parts by weight of a crosslinking agent; about 0.01 to about 5 parts by weight of a silane coupling agent; and about 0.01 to about 5 parts by weight of a crosslinking catalyst.
    Type: Grant
    Filed: December 10, 2010
    Date of Patent: January 26, 2016
    Assignee: CHEIL INDUSTRIES, INC.
    Inventors: Woo Jin Jeong, Hee Yeon Ki, Hae Ryong Chung
  • Adhesive film for heat dissipation, semiconductor device including the same, and method of fabricating the semiconductor device
    Patent number: 9240364
    Abstract: A heat dissipation adhesive film, a semiconductor device including the same, and a method of fabricating the semiconductor device, the heat dissipation adhesive film being placeable between a protective layer encasing a semiconductor element therein and a heat dissipation metal layer on the protective layer to bond the protective layer to the heat dissipation metal layer, wherein an adhesive strength between the heat dissipation adhesive film and the protective layer and an adhesive strength between the heat dissipation adhesive film and the heat dissipation metal layer are each about 3 kgf/25 mm2 or greater.
    Type: Grant
    Filed: March 10, 2014
    Date of Patent: January 19, 2016
    Assignee: CHEIL INDUSTRIES, INC.
    Inventors: Baek Soung Park, Jae Won Choi, In Hwan Kim, Gyu Seok Song, Su Mi Lim
  • Process of preparing a gap filler agent, a gap filler agent prepared using same, and a method for manufacturing semiconductor capacitor using the gap filler agent
    Patent number: 9240443
    Abstract: A method of preparing a gap filler agent includes adding a halosilane to a basic solvent, and, to the basic solvent and the halosilane, adding ammonia in an amount of about 50 to about 70 parts by weight based on 100 parts by weight of the halosilane at a rate of about 1 g/hr to about 15 g/hr.
    Type: Grant
    Filed: December 31, 2013
    Date of Patent: January 19, 2016
    Assignee: CHEIL INDUSTRIES, INC.
    Inventors: Jin-Hee Bae, Han-Song Lee, Taek-Soo Kwak, Go-Un Kim, Bo-Sun Kim, Sang-Kyun Kim, Yoong-Hee Na, Eun-Su Park, Jin-Woo Seo, Hyun-Ji Song, Sang-Hak Lim, Wan-Hee Lim, Seung-Hee Hong, Byeong-Gyu Hwang
  • THERMOSETTING COMPOSITION FOR ORGANIC LIGHT-EMITTING ELEMENT FILLER AND ORGANIC LIGHT-EMITTING ELEMENT DISPLAY DEVICE COMPRISING SAME
    Publication number: 20160005995
    Abstract: The present invention relates to a thermosetting composition for an organic light-emitting element filler, which comprises (A) 100 parts by weight of an epoxy-based resin including (A1) an epoxy resin having a weight average molecular weight of around about 200 g/mol or more to less than about 1000 g/mol, (A2) an epoxy resin having a weight average molecular weight of around about 1000 g/mol or more to less than about 20000 g/mol and (A3) an epoxy resin having a weight average molecular weight of about 20000 g/mol or more to less than about 100000 g/mol, (B) about 10 parts by weight to about 40 parts by weight of a sheet-like filler and (C) about 0.1 parts by weight to about 20 parts by weight of an imidazole curing agent having a cyano group; and an organic light-emitting element display device comprising the same.
    Type: Application
    Filed: December 27, 2013
    Publication date: January 7, 2016
    Applicant: CHEIL INDUSTRIES INC.
    Inventors: Mi Sun KIM, Taek Jin BAEK, Gyu Seok SONG, In Jae SONG, Jin Ah LEE, Seung Jib CHOI
  • Low gloss thermoplastic resin composition with soft touch surface and molded article therefrom
    Patent number: 9228046
    Abstract: Disclosed herein is a low gloss thermoplastic resin composition with a soft touch surface comprising (A) about 10 to about 80% by weight of a soft rubbery aromatic vinyl copolymer resin which comprises rubber particles with a graft ratio of about 40 to about 90% and an average particle diameter of about 6 to about 20 ?m as a dispersed phase; (B) about 4 to about 60% by weight of a rubber-modified aromatic vinyl copolymer resin; and (C) about 5 to about 80% by weight of an aromatic vinyl-vinyl cyanide copolymer resin. The molded article molded from the thermoplastic resin composition can have a soft touch surface as well as excellent low gloss and impact strength.
    Type: Grant
    Filed: June 30, 2010
    Date of Patent: January 5, 2016
    Assignee: Cheil Industries Inc.
    Inventors: Jae Keun Hong, Hwan Seok Park, Byeong Do Lee, Young Sub Jin, Ho Ryong Sun, Sung Kwan Kim, Young Don Yoo
  • Resin Composition and Moulded Article Using Same
    Publication number: 20150376396
    Abstract: A resin composition includes (A) a thermoplastic resin, (B) a first metal layer-resin composite particle including a first metal layer and first thermosetting resin coating layers positioned on the first metal layer and (C) a second metal layer-resin composite particle including a second metal layer and second thermosetting resin coating layers positioned on the second metal layer, and a molded article using the same.
    Type: Application
    Filed: September 2, 2013
    Publication date: December 31, 2015
    Applicant: Cheil Industries Inc.
    Inventors: Seon-Ae LEE, Young-Sin KIM, Min-Young LIM, Kang-Yeol PARK
  • Optical films for reducing color shift and organic light-emitting display apparatuses employing the same
    Patent number: 9224984
    Abstract: Optical films, and organic-light-emitting display apparatuses, include a high refractive index pattern layer including a first surface and a second surface facing each other. The first surface includes a pattern having grooves. The grooves each have a curved surface and a depth greater than a width. The high refractive index pattern layer is formed of a material having a refractive index greater than 1. Further included is a low refractive index pattern layer formed of a material having a refractive index smaller than that of the material constituting the high refractive index pattern layer. The low refractive index pattern layer includes a filling material for filling grooves. A tilt angle, ?, of each groove satisfies the following condition, 15°???75°.
    Type: Grant
    Filed: November 25, 2013
    Date of Patent: December 29, 2015
    Assignees: SAMSUNG ELECTRONICS CO., LTD., CHEIL INDUSTRIES INC., CORNING PRECISION MATERIALS CO., LTD.
    Inventors: Hong-shik Shim, Chul-Ho Jeong, Eun-Young Cho, You-Min Shin, Eui-Soo Kim, Young Oh, Hyun-Min Kim
  • CURABLE POLYSILOXANE COMPOSITION FOR OPTICAL DEVICE, ENCAPSULATING MATERIAL AND OPTICAL DEVICE
    Publication number: 20150368468
    Abstract: Disclosed are a curable polysiloxane composition for an optical device including at least one kind of a first siloxane compound represented by Chemical Formula 1, at least one kind of a second siloxane compound having hydrogen bound to silicon (Si—H) at the terminal end, and at least one kind of a third siloxane compound having an alkenyl group bound to silicon (Si-Vi) at the terminal end, an encapsulating material obtained by curing the curable polysiloxane composition for an optical device, and an optical device including the encapsulating material. (R1R2R3SiO1/2)M1(R4R5SiO2/2)D1(L1-O)D2(L2-O)D3(R6R7SiO2/2)D4(L3-O-L4-O)D5(R8SiO2/2—Y1—SiO2/2R9)D6(R10R11Si—Y2)D7(R12SiO3/2)T1(R13SiO3/2)T2(SiO3/2—Y3—SiO3/2)T3(SiO4/2)Q1 ??[Chemical Formula 1] In Chemical Formula 1, R1 to R13, Y1 to Y3, M1, D1 to D7, T1 to T3 and Q1 are the same as defined in the specification.
    Type: Application
    Filed: December 6, 2013
    Publication date: December 24, 2015
    Applicant: CHEIL INDUSTRIES INC.
    Inventors: Hong-Jung YOO, Young-Ho KIM, Woo-Han KIM, Dong-Ju SHIN, Dong-Il HAN
  • Optical film for reducing color shift and organic light-emitting display device employing the same
    Patent number: 9219250
    Abstract: An optical film includes: a high refractive index pattern layer including a material having a refractive index greater than 1 and having a first surface and a second surface which face each other, where a plurality of grooves is defined in the first surface, and each of the plurality of grooves is defined by a curved surface portion of the first surface of the high refractive index pattern and has a depth greater than a width thereof; and a low refractive index pattern layer including a plurality of protruding patterns disposed in the plurality of grooves, having a refractive index less than the refractive index of the high refractive index pattern layer, and including a plurality of layers having different refractive indices from each other.
    Type: Grant
    Filed: June 4, 2014
    Date of Patent: December 22, 2015
    Assignees: SAMSUNG ELECTRONICS CO., LTD., CHEIL INDUSTRIES INC.
    Inventors: Chul-ho Jeong, Eun-young Cho, Hyun-min Kim, You-min Shin, Hong-shik Shim, Young Oh
  • ORGANIC COMPOUND, ORGANIC OPTOELECTRONIC ELEMENT, AND DISPLAY DEVICE
    Publication number: 20150364694
    Abstract: An organic compound represented by Chemical Formula 1, an organic optoelectronic device including the organic compound, and a display device including the organic optoelectronic device are disclosed.
    Type: Application
    Filed: August 8, 2013
    Publication date: December 17, 2015
    Applicant: CHEIL INDUSTRIES INC.
    Inventors: Han-Ill LEE, Eun-Sun YU, Dong-Min KANG, Eui-Su KANG, Young-Sung PARK, Ji-Hun SHIN, Yong-Tak YANG, Jae-Jin OH, Dong-Kyu RYU, Sang-Shin LEE, Yu-Na JANG, Soo-Young JEONG, Su-Jin HAN, Jin-Seok HONG
  • MONOMER, HARDMASK COMPOSITION COMPRISING MONOMER, AND PATTERN FORMING METHOD USING HARDMASK COMPOSITION
    Publication number: 20150362837
    Abstract: Disclosed are a monomer for a hardmask composition represented by the following Chemical Formula 1, a hardmask composition including the monomer, and a method of forming patterns using the hardmask composition. In the above Chemical Formula 1, A, A?, X, Y, l, m and n are the same as described in the detailed description.
    Type: Application
    Filed: May 8, 2013
    Publication date: December 17, 2015
    Applicant: CHEIL INDUSTRIES INC.
    Inventors: Yong-Woon YOON, Sung-Jae LEE, Joon-Young MOON, You-Jung PARK, Chul-Ho LEE, Youn-Jin CHO
  • Epoxy resin composition for encapsulating semiconductor device and semiconductor device using the same
    Patent number: 9212253
    Abstract: An epoxy resin composition for encapsulating a semiconductor device, the epoxy resin composition including an epoxy resin, a curing agent, and one or more inorganic fillers, the one or more inorganic fillers including prismatic cristobalite, the prismatic cristobalite being present in the epoxy resin composition in an amount of about 1 to about 50% by weight, based on the total weight of the epoxy resin composition.
    Type: Grant
    Filed: June 29, 2010
    Date of Patent: December 15, 2015
    Assignee: CHEIL INDUSTRIES, INC.
    Inventors: Young Kyun Lee, Eun Jung Lee, Yoon Kok Park