Abstract: A hot melt adhesive is disclosed, to be used in gluing guns, and consisting of a polyamide resin obtained by polycondensation of an aliphatic diamine with a fatty acid mixture, said fatty acid mixture consisting of unsaturated fatty acid monomers and polymers with a maximum dimer content of 80% by weight to which are added, in a quantity of not less than 10% by weight of the fatty acid mixture, aliphatic bicarboxylic acids and/or their esters with a polyethylene chain containing 6 to 10 carbon atoms. As an alternative a quantity of not less than 4% by weight of the fatty acid mixture, aromatic bicarboxylic acids and/or their esters, or mixtures of these latter with aliphatic bicarboxylic acids, can be added to the mixture.