Patents Assigned to Chemical Process Corporation
  • Patent number: 4692478
    Abstract: The process of preparing a formaldehyde-free, thermosetting resin which is especially useful for bonding lignocellulosic materials together to form plywood or particle board, which process comprises first reacting an aqueous preparation containing a carbohydrate raw material with a mineral acid to convert the carbohydrate to polymerizable reactants and second reacting the polymerizable reactants with ammonia to form the thermosetting resin. The resin can be further cross-linked to form an insoluble resinous material by heating.
    Type: Grant
    Filed: March 14, 1986
    Date of Patent: September 8, 1987
    Assignee: Chemical Process Corporation
    Inventors: Tito Viswanathan, Donald H. Westermann
  • Patent number: 4524164
    Abstract: A thermosetting adhesive resin suitable for binding lignocellulosic materials to form products, such as plywood or particle board, is prepared by heating an aqueous sugar or starch solution in the presence of an inorganic acid or its ammonium salt and a metal ion catalyst to obtain a partially polymerized resin which is reacted with an organic acid anhydride just prior to application to the lignocellulosis materials. The adhesive formula contains no formaldehyde and the preferred aqueous solutions are whey or whey byproduct concentrates.
    Type: Grant
    Filed: March 23, 1984
    Date of Patent: June 18, 1985
    Assignee: Chemical Process Corporation
    Inventors: Tito Viswanathan, Thomas Richardson