Patents Assigned to Chemicals, Inc.
  • Sprayable hard surface cleaner and method of use
    Patent number: 6784148
    Abstract: The present invention is a non-corrosive, low-fuming oven cleaning composition that can be used easily on vertical oven surfaces. The present invention is a cleaning composition containing a tripolyphosphate and a thickening agent to promote in adherence to vertical surfaces.
    Type: Grant
    Filed: April 18, 2001
    Date of Patent: August 31, 2004
    Assignee: Kay Chemical, Inc
    Inventors: Tami Jo Tadrowski, Karen Odom Rigley
  • Halogen addition for improved adhesion of CVD copper to barrier
    Patent number: 6783868
    Abstract: A process is described for depositing a copper film on a substrate surface by chemical vapor deposition of a copper precursor. The process includes treating a diffusion barrier layer surface and/or a deposited film with an adhesion-promoting agent and annealing the copper film to the substrate. Suitable adhesion-promoting agents include, e.g., organic halides, such as methylene chloride, diatomic chlorine, diatomic bromine, diatomic iodine, HCl, HBr and HI. Processes of the invention provide copper-based films, wherein a texture of the copper-based films is predominantly (111). Such films provide substrates having enhanced adhesion between the diffusion barrier layer underlying the (111) film and the copper overlying the (111) film.
    Type: Grant
    Filed: October 14, 2002
    Date of Patent: August 31, 2004
    Assignee: Air Products and Chemicals, Inc.
    Inventors: Ralph J. Ciotti, Scott Edward Beck, Eugene Joseph Karwacki, Jr.
  • Epoxy resin composition, cured article thereof, novel epoxy resin, novel phenol compound, and process for preparing the same
    Patent number: 6784228
    Abstract: The present invention relates to an epoxy resin composition a cure article thereof, a novel epoxy resin used therein, a polyhydric phenol compound suited for used as an intermediate thereof, and a process for preparing the same. One of the objects to be achieved by the present invention is to exert the heat resistance, the moisture resistance, the dielectric performances and the flame-resistant effect required of electric or electronic materials such as semiconductor encapsulating materials and varnishes for circuit boards in the epoxy resin composition.
    Type: Grant
    Filed: July 9, 2002
    Date of Patent: August 31, 2004
    Assignee: Dainippon Ink and Chemicals, Inc.
    Inventors: Ichiro Ogura, Yoshiyuki Takahashi, Tomoyuki Imada
  • Hydroxy-amino thermally cured undercoat of 193 nm lithography
    Patent number: 6783916
    Abstract: The present invention is directed to a thermally curable polymer composition, and a photolithographic substrate coated therewith, the composition comprising a hydroxyl-containing polymer, an amino cross-linking agent and a thermal acid generator. The thermally curable polymer composition may be dissolved in a solvent and used as an undercoat layer in deep UV lithography.
    Type: Grant
    Filed: July 9, 2001
    Date of Patent: August 31, 2004
    Assignee: Arch Specialty Chemicals, Inc.
    Inventors: Patrick Foster, Sydney George Slater, Thomas Steinhäusler, Andrew J. Blakeney, John Joseph Biafore
  • Deinking method and composition for wastepaper
    Patent number: 6784146
    Abstract: The present invention is a deinking method and composition that uses at least 50% by weight based on the total weight of surfactants of non-ionic, C16 to C25 aliphatic, monohydric alcohol alkoxylates having 14 to 40 moles of ethylene oxide per mole of alcohol and 0 to 10 moles of propylene oxide per mole of alcohol. Using deinking compositions to deink wastepaper pulp wherein the surfactants primarily include the C16 to C18 aliphatic alcohol alkoxylates of the invention produces paper having excellent brightness and low effective residual ink concentrations. In addition, a low amount of sizing agents is used to produce paper having acceptable levels of water repellency.
    Type: Grant
    Filed: October 27, 2000
    Date of Patent: August 31, 2004
    Assignee: Kemira Chemicals, Inc.
    Inventors: Jing Luo, David D. Dreisbach, Michael Lease Hemenway
  • Active energy ray-curable polyimide resin composition
    Patent number: 6784275
    Abstract: Disclosed is an active energy ray-curable polyimide resin composition which comprises a polymerizable polyimide resin (I) having an isocyanurate ring, an alicyclic structure, an imide ring and a (meth)acryloyl group and being capable of patterning with a dilute alkali aqueous solution.
    Type: Grant
    Filed: June 27, 2002
    Date of Patent: August 31, 2004
    Assignee: Dainippon Ink and Chemicals, Inc.
    Inventors: Eiju Ichinose, Yohzoh Yamashina, Hidenobu Ishikawa
  • Fluoropolymer resins containing ionic or ionizable groups and products containing the same
    Patent number: 6780935
    Abstract: A polymer blend is described which contains at least one acrylic resin or vinyl resin having at least one ionic or ionizable group and at least one thermoplastic fluoropolymer. Preferably, the polymer blend is an intimate blend of the two polymers which are useful in a variety of applications including in the formation of a membrane which is useful in batteries and fuel cells and the like. Methods of making the polymer blends are also described.
    Type: Grant
    Filed: January 30, 2001
    Date of Patent: August 24, 2004
    Assignee: Atofina Chemicals, Inc.
    Inventors: Lotfi Hedhli, Laurent Billon
  • Anhydride-modified chitosan, method of preparation thereof, and fluids containing same
    Patent number: 6780822
    Abstract: The invention provides an organic diacid anhydride-modified chitosan and a method of preparing the same under high shear conditions which eliminates the use of solvents and excessive amounts of aqueous liquids. Also provided are organic diacid anhydride-modified chitosans containing an inorganic basic material which enhances the aging stability thereof. The invention also provides fluids useful in various well drilling and servicing operations comprising an alkaline aqueous liquid containing an organic diacid anhydride-modified chitosan, as well as a method of drilling wells therewith.
    Type: Grant
    Filed: January 21, 2003
    Date of Patent: August 24, 2004
    Assignee: Venture Chemicals, Inc.
    Inventors: Jack C. Cowan, Roy F. House, Tammy L. Rodrigue
  • Method of treating a metal surface with a no rinse zinc phosphate coating
    Patent number: 6780256
    Abstract: An aqueous solution and method for applying the solution to a metal surface form a zinc phosphate coating on the metal surface. The zinc phosphate coating minimizes corrosion and improves adhesion of subsequently coated materials such as sealants and paints. The solution of the composition and method of application consume free acidity otherwise left on the metal surface, and obviate the need for subsequent rinsing or extensive drying or stoving operations. The composition includes an aqueous solution including water, a zinc source, phosphoric acid, a polyhydric compound (preferably pentaerythritol), a metal salt, and optionally, an oxidizer.
    Type: Grant
    Filed: August 27, 2002
    Date of Patent: August 24, 2004
    Assignee: Bulk Chemicals, Inc.
    Inventor: José B. Rivera
  • Method of producing high purity germanium tetrafluoride
    Patent number: 6780390
    Abstract: A method of producing high purity germanium tetrafluoride comprising the step of flowing a mixture of inert gas and fluorine gas through a reactor chamber preferably containing germanium powder. The reactor effluent stream is conducted through at least one product trap effective for condensing and retaining at least a portion of the germanium tetrafluoride product. The product is preferably then purified by repeatedly subliming the product as necessary to remove volatile impurities.
    Type: Grant
    Filed: August 14, 2002
    Date of Patent: August 24, 2004
    Assignee: Advance Research Chemicals, Inc.
    Inventors: Sudhir Solomon Bhagat, Dayal T. Meshri, Sanjay D. Meshri, Michale Shane Petty
  • Process for the fluorination of boron hydrides
    Patent number: 6781005
    Abstract: This invention relates to an improvement in a liquid phase process for the direct fluorination of borohydride salts including the B10H10−2 and B12H12−2 salts wherein said borohydride salt is contacted with fluorine, under conditions for forming said fluorinated borohydride salt. The improvement in the liquid phase process resides in effecting the fluorination of said borohydride salt in the presence of a reaction medium having an acidity between that of water and anhydrous HF. More specifically, the reaction medium should have a Hammett acidity, Ho, between 0>Ho>−11.
    Type: Grant
    Filed: May 1, 2003
    Date of Patent: August 24, 2004
    Assignee: Air Products and Chemicals, Inc.
    Inventors: William Jack Casteel, Jr., Sergei Vladimirovich Ivanov
  • N-substituted arylamino-phenol-formaldehyde condensates
    Patent number: 6780511
    Abstract: There is disclosed N-substituted arylamino-phenol-formaldehyde condensates which are substantially free of water, contain not more than 2% by weight of a phenol and possess unobvious properties, e.g., which have the residues of an N-substituted arylamine and 1.5 to 3 moles of formaldehyde for each mole of the said arylamine, contain from about 35% to 63% by weight of phenol residue, contain at least 3.5% by weight of nitrogen, have a melt viscosity of less than 2,000 cps at 175° C., a hydroxyl equivalent of about 195 to 220, a Methanol Tolerance of at least 40%, high solubility in organic solvents commonly used in epoxy formulations, and are self-catalyzing curatives for epoxy resins.
    Type: Grant
    Filed: September 5, 2002
    Date of Patent: August 24, 2004
    Assignee: Borden Chemical, Inc.
    Inventor: Arthur H. Gerber
  • Molding material for electrical and electronic parts
    Patent number: 6780963
    Abstract: The polyamide resin composition of the invention is characterized by having a solder reflow heat-resistant temperature of not lower than 250° C. Since the polyamdie resin composition has low water absorption and is excellent in moldability, heat resistance, shape stability and mechanical strength, it can be suitably used for, for example, automobile parts and electric or electronic parts.
    Type: Grant
    Filed: August 21, 2002
    Date of Patent: August 24, 2004
    Assignee: Mitsui Chemicals, Inc.
    Inventors: Masahiro Sawada, Kunihiro Ohuchi
  • Chemical mechanical polishing slurry composition for polishing conductive and non-conductive layers on semiconductor wafers
    Publication number: 20040159050
    Abstract: A novel CMP slurry composition used for polishing metals, the composition comprising: a dispersion solution comprising an abrasive. The slurry composition has a large particle count of about 25 to about 150,000 particles having a particle size greater than 0.5 &mgr;m in 30 &mgr;L of slurry, which is achieved by filtering the slurry composition prior to use. Also, the inclusion of a chemical activity enhancer, such as, an amine and a corrosion inhibitor, results in the appropriate copper removal rate without increasing static etch rates.
    Type: Application
    Filed: December 1, 2003
    Publication date: August 19, 2004
    Applicant: ARCH SPECIALTY CHEMICALS, INC.
    Inventors: Anthony Mark Pasqualoni, Deepak Mahulikar, Larry A. LaFollette, Richard J. Jenkins
  • Stable non-photosensitive polyimide precursor compositions for use in bilayer imaging systems
    Publication number: 20040161711
    Abstract: Stable non-photosensitive polyimide precursor compositions with an adhesion promoter in a non-NMP solvent for use in forming high temperature resistant relief images and a process for making said images.
    Type: Application
    Filed: December 10, 2003
    Publication date: August 19, 2004
    Applicant: ARCH SPECIALTY CHEMICALS, INC.
    Inventors: Ilya Rushkin, Ahmad A. Naiini, William D. Weber, Don Perry, Richard Hopla
  • Process for producing a heat resistant relief structure
    Publication number: 20040161619
    Abstract: A process for producing a heat resistant relief structure on a substrate, the process comprising the steps of:
    Type: Application
    Filed: December 10, 2003
    Publication date: August 19, 2004
    Applicant: ARCH SPECIALTY CHEMICALS, INC.
    Inventors: Ilya Rushkin, Ahmad A. Naiini, William D. Weber, Pamela J. Waterson, Richard Hopla
  • Multilayered article, vessel and resin composition based on polyethylene
    Patent number: 6777491
    Abstract: A multilayered article and vessel, which are superior in the properties, such as shock resistance, rigidity, an ability to barrier against gasoline and interlayer adhesion, and are permissible of being recycled for reuse, comprising a base layer (A1) comprising a polyetylene resin (a1) having an MFR (ASTM D 1238, 190° C., 2160 g) of 0.001 to 0.5 g/10 min. and a density of 0.945 to 0.980 g/cm3, an adhesive layer (A2) comprising a modified etylene/&agr;-olefin copolymer (a2) which is modified by having grafted thereon an unsaturated carboxylic acid or its derivative and has a density of 0.900 to 0.940 and a barriering layer (B) comprising an ethylene/vinyl alcohol copolymer (b), wherein the Izod impact strength (with notch) (ASTM D 256, −40° C.
    Type: Grant
    Filed: August 11, 2000
    Date of Patent: August 17, 2004
    Assignee: Mitsui Chemicals, Inc.
    Inventors: Hideshi Kawachi, Hiromi Shigemoto, Yuichiro Terashi
  • Solid detergents with active enzymes and bleach
    Patent number: 6777383
    Abstract: A detergent composition is described which is a solid homogeneous, evenly dispersed composition containing anionic and nonionic surfactants, soil suspending agents, chelating or sequestering agents, and alkaline builders. The detergent compositions will contain either active enzymes, an oxygen releasing bleaching agent or both. The active enzymes can be protease, amylase or lipase enzymes. Said composition can be used for laundry washing or hard surface cleaning. Manufacturing procedures and methods of use are described.
    Type: Grant
    Filed: March 27, 2002
    Date of Patent: August 17, 2004
    Assignee: Sunburst Chemicals, Inc.
    Inventor: William H. Scepanski
  • Packaging materials having barrier coatings based on water-epoxy resin copolymers
    Patent number: 6777088
    Abstract: A multilayer packaging material comprising (a) at least one layer of a gas-permeable material, and (b) at least one layer of a gas-barrier coating comprising a polymeric polyol made by copolymerizing a multifunctional epoxide resin and water in the presence of an amount of acid effective for polymerizing the epoxide resin and the water, the amount of water being sufficient to avoid gelation, the polymeric polyol optionally reacted with a crosslinking agent for hydroxyl functionality, especially an amino resin.
    Type: Grant
    Filed: April 1, 2002
    Date of Patent: August 17, 2004
    Assignee: Air Products and Chemicals, Inc.
    Inventors: Frederick Herbert Walker, Frank Ralph Pepe, John Bartram Dickenson
  • Hydrogen fluxless soldering by electron attachment
    Patent number: 6776330
    Abstract: A method of dry fluxing metal surfaces of one or more components to be soldered, comprising the steps of: a) providing one or more components to be soldered which are connected to a first electrode as a target assembly; b) providing a second electrode adjacent the target assembly; c) providing a gas mixture comprising a reducing gas between the first and second electrodes; d) providing a direct current (DC) voltage to the first and second electrodes and donating electrons to the reducing gas to form negatively charged ionic reducing gas; e) contacting the target assembly with the negatively charged ionic reducing gas and reducing oxides on the target assembly.
    Type: Grant
    Filed: September 10, 2001
    Date of Patent: August 17, 2004
    Assignee: Air Products and Chemicals, Inc.
    Inventors: Chun Christine Dong, Wayne Thomas McDermott, Richard E. Patrick, Brenda F. Ross