Patents Assigned to ChemPar Corporation
  • Method of making cutting, scoring and embossing die set
    Patent number: 4112827
    Abstract: A die set for cutting, scoring and embossing sheet material comprises a first die having cutting rules, scoring rules and embossing means attached to a base, a mating die cooperating with the first die having mating embossing means for cooperating with the first embossing means on the first die and registering means on the first die and the mating die for ensuring proper registration of the first embossing means and the mating embossing means.
    Type: Grant
    Filed: June 3, 1977
    Date of Patent: September 12, 1978
    Assignee: ChemPar Corporation
    Inventor: Pierson S. Kang