Abstract: A process for cleaning semiconductor fabrication equipment parts includes determining a definition for a clean part including multiple maximum acceptable impurity levels; determining an initial multiple impurity levels of a part prior to its cleaning; determining a cleaning process to apply to the part; applying the cleaning process to the part, wherein the cleaning process creates reduced multiple impurity levels for the part below that of the initial multiple impurity levels; determining the reduced multiple impurity levels; comparing the reduced multiple impurity levels against the multiple maximum acceptable impurities levels of the definition; and repeating the application of the cleaning process to the part if the reduced multiple impurity levels do not meet the definition of a clean part. A dilute aqueous cleaning solution for cleaning parts includes 0.5-1.5% wt. HF; 0.1-0.5% wt. HNO3; and 1-10% wt H2O2.

Abstract: A system and method are provided for using an organic solvent to clean chamber parts used in semiconductor manufacturing. The chamber parts are exposed to the solvent using a dipping system or a vapor contact system in order to soften or dissolve the organic polymers. The solvent may be heated up to a temperature of 100° C. The organic cleaning solvent may be a pyrrole-based, amine-based, fluoro/ether-based or ether-based solvent. Additionally, a system and method are provided for establishing criteria to verify that the chamber parts are clean with respect to organic, metallic and particulate impurities and establishing criteria to verify that the physical surface morphology remains intact.

Abstract: A hazardous material and shipment system (kit) includes a containment box, a closeable bottle, a unitary foam positioning body, and an absorbent sleeve. The unitary positioning body is positioned within the containment box and is provided with an aperture. The closeable bottle has a screw cap, is made from a material compatible with the hazardous material, and fits within the aperture of the positioning body. An optional removable top member covers the aperture to secure the bottle therein. The bottle is preferably a part of a bottle assembly including a sealing tape, the absorbent sleeve, and a plastic bag, which provide multiple containments for liquid leaks and spills. A method for containing hazardous materials includes placing a desired amount of the hazardous material in a bottle body having a threaded neck and then engaging a screw cap with the threaded neck to provide a closed bottle with the hazardous material inside.

Abstract: A low contamination bottle for sampling, storing, and transporting of chemical samples includes a bottle portion defining an internal volume and having a threaded neck, and a cap portion provided with threads that engage the threaded neck of the bottle to provide a fluid-tight seal between the internal volume of the bottle and the ambient environment. The bottle has a flexible sidewall portion that permits the reduction of the internal volume to allow a liquid sample to be drawn into the bottle portion by a suction or vacuum process. Both the bottle portion and the cap portion are made from a material selected from the chemical resistant group consisting essentially of hydrocarbon polymers and fluorocarbon polymers, where the material generates less then 1 ppb of metal contaminants and 1 ppm of leachable anionic and organic contaminants. The flexible sidewall portion of the bottle portion has a minimum thickness of 0.