Abstract: This invention relates to a radiator and its preparation method, and especially refers to a fin-pipe shaped radiator specially applied to semiconductor chilling unit and its preparation method. This radiator consists of vertical pipe and upper & lower horizontal pipe (both ends are blocked) welded into the heat radiation chamber, and the evaporator connected through pipeline with axially extending fins distributed on the external surface of the horizontal pipe and the vertical pipe in an angle “?” at the joint within the range of 0°<??90°. The main components are manufactured into sections by extruding, punching or other machining techniques and then soldered into a radiator. It has overcome the disadvantages of various and numerous welding points, complicated techniques and so on in existing manufactures, and has realized an industrialized batch production upon simple and reliable techniques.