Abstract: A multi-operation wafer baking system includes a chassis; a wafer loading device mounted on the chassis for laterally moving a wafer; a cruciform transportation device mounted on the chassis for receiving a wafer from the wafer loading device and including a base, an elevation platform, and a rotation platform mounted on the elevation platform and having four carrier arms for carrying wafers; an annular baking device mounted on the chassis to oppose the cruciform transportation device and including a central turn table, a plurality of wafer racks, and a plurality of baking tray assemblies functioning to receive wafers from corresponding wafer racks for performing a baking operation on the wafer; and an unloading device mounted on the chassis for receiving baked wafers. This system allows for baking wafers in a multi-operation manner to thereby improve throughput.