Patents Assigned to Cheng Kung Capital, LLC
  • Patent number: 8802503
    Abstract: An LED package with an extended top electrode and an extended bottom electrode is formed from a first metal and a second metal. An LED is on an inner end of the first metal. An outer end of the first metal has been bent upward twice 90 degrees to form a top flat as an extended top electrode of the package. An outer end of the second metal has been bent downward twice 90 degrees to form a bottom flat as an extended bottom electrode of the package. The LED and a bonding wire may be encapsulated with glue.
    Type: Grant
    Filed: March 11, 2014
    Date of Patent: August 12, 2014
    Assignee: Cheng Kung Capital, LLC
    Inventor: Jiahn-Chang Wu
  • Publication number: 20140193930
    Abstract: An LED package with an extended top electrode and an extended bottom electrode is formed from a first metal and a second metal. An LED is on an inner end of the first metal. An outer end of the first metal has been bent upward twice 90 degrees to form a top flat as an extended top electrode of the package. An outer end of the second metal has been bent downward twice 90 degrees to form a bottom flat as an extended bottom electrode of the package. The LED and a bonding wire may be encapsulated with glue.
    Type: Application
    Filed: March 11, 2014
    Publication date: July 10, 2014
    Applicant: Cheng Kung Capital, LLC
    Inventor: Jiahn-Chang Wu
  • Patent number: 8710540
    Abstract: An LED package with an extended top electrode and an extended bottom electrode is formed from a first metal and a second metal. An LED is on an inner end of the first metal. An outer end of the first metal has been bent upward twice 90 degrees to form a top flat as an extended top electrode of the package. An outer end of the second metal has been bent downward twice 90 degrees to form a bottom flat as an extended bottom electrode of the package. The LED and a bonding wire may be encapsulated with glue.
    Type: Grant
    Filed: August 29, 2013
    Date of Patent: April 29, 2014
    Assignee: Cheng Kung Capital, LLC
    Inventor: Jiahn-Chang Wu
  • Publication number: 20140042483
    Abstract: An LED package with an extended top electrode and an extended bottom electrode is made from a single metal sheet, one manufacturing process embodiment includes: preparing a piece of single metal sheet, forming a first metal and a coplanar second metal, mounting an LED on an inner end of the first metal, wire-bonding top electrode to an inner end of the second metal, encapsulating at least the LED and the bonding wire with a protection glue, bending an outer end of the first metal upward twice 90 degrees to form a top flat as an extended top electrode of the package, and bending an outer end of the second metal downward twice 90 degrees to form a bottom flat as an extended bottom electrode of the package.
    Type: Application
    Filed: August 29, 2013
    Publication date: February 13, 2014
    Applicant: Cheng Kung Capital, LLC
    Inventor: Jiahn-Chang Wu
  • Patent number: 8524541
    Abstract: An LED package with an extended top electrode and an extended bottom electrode is made from a single metal sheet, one manufacturing process embodiment includes: preparing a piece of single metal sheet, forming a first metal and a coplanar second metal, mounting an LED on an inner end of the first metal, wire-bonding top electrode to an inner end of the second metal, encapsulating at least the LED and the bonding wire with a protection glue, bending an outer end of the first metal upward twice 90 degrees to form a top flat as an extended top electrode of the package, and bending an outer end of the second metal downward twice 90 degrees to form a bottom flat as an extended bottom electrode of the package.
    Type: Grant
    Filed: July 12, 2012
    Date of Patent: September 3, 2013
    Assignee: Cheng Kung Capital, LLC
    Inventor: Jiahn-Chang Wu
  • Publication number: 20120273835
    Abstract: An LED package with an extended top electrode and an extended bottom electrode is made from a single metal sheet, one manufacturing process embodiment includes: preparing a piece of single metal sheet, forming a first metal and a coplanar second metal, mounting an LED on an inner end of the first metal, wire-bonding top electrode to an inner end of the second metal, encapsulating at least the LED and the bonding wire with a protection glue, bending an outer end of the first metal upward twice 90 degrees to form a top flat as an extended top electrode of the package, and bending an outer end of the second metal downward twice 90 degrees to form a bottom flat as an extended bottom electrode of the package.
    Type: Application
    Filed: July 12, 2012
    Publication date: November 1, 2012
    Applicant: Cheng Kung Capital, LLC
    Inventor: Jiahn-Chang WU
  • Patent number: 8247835
    Abstract: An LED package with an extended top electrode and an extended bottom electrode is made from a single metal sheet, one manufacturing process embodiment includes: preparing a piece of single metal sheet, forming a first metal and a coplanar second metal, mounting an LED on an inner end of the first metal, wire-bonding top electrode to an inner end of the second metal, encapsulating at least the LED and the bonding wire with a protection glue, bending an outer end of the first metal upward twice 90 degrees to form a top flat as an extended top electrode of the package, and bending an outer end of the second metal downward twice 90 degrees to form a bottom flat as an extended bottom electrode of the package.
    Type: Grant
    Filed: September 4, 2009
    Date of Patent: August 21, 2012
    Assignee: Cheng Kung Capital, LLC
    Inventor: Jiahn-Chang Wu