Patents Assigned to Cheng Loong Corporation
  • Patent number: 7394378
    Abstract: An electronic tagged box comprises a box body; a buffer layer mounted inside the box body; an absorber mounted on one side of the buffer layer; and a RFID tag mounted outside the box body corresponding to the buffer layer, whereby receiving distance and range of the RFID tag can be increased.
    Type: Grant
    Filed: November 2, 2005
    Date of Patent: July 1, 2008
    Assignee: Cheng Loong Corporation
    Inventor: Ying-Chang Liu
  • Publication number: 20040224156
    Abstract: A waterproof heat-preservative film is formed by providing a melt of a waterproof material, mixing phase-change microcapsules with the melt to form a mixture, solidifying the mixture and pulverizing the solidified mixture to form particles containing phase-change microcapsules, and forming a film with the particles by means of extruding or blowing.
    Type: Application
    Filed: May 6, 2003
    Publication date: November 11, 2004
    Applicant: CHENG LOONG CORPORATION
    Inventor: Chieh-Jen Wu
  • Patent number: 6805945
    Abstract: A waterproof heat-preservative film is formed by providing a melt of a waterproof material, mixing phase-change microcapsules with the melt to form a mixture, solidifying the mixture and pulverizing the solidified mixture to form particles containing phase-change microcapsules, and forming a film with the particles by means of extruding or blowing.
    Type: Grant
    Filed: May 6, 2003
    Date of Patent: October 19, 2004
    Assignee: Cheng Loong Corporation
    Inventor: Chieh-Jen Wu
  • Patent number: 6793908
    Abstract: A solution method for preparing indium-tin oxide (ITO) powders is provided. Indium compounds and tin compounds are dissolved in water respectively to form two solution bodies. Some proper additives are added into the solution bodies to form metal hydroxyl compounds with determined composition. After water washing and filtration, proper additives are added into the solution to peptize the solution. During the peptization process, hydrolysis and condensation reactions occurs between different metal hydroxyl compounds. Solvent of the solution is then removed to form high quality nanometer grade ITO powders.
    Type: Grant
    Filed: May 9, 2002
    Date of Patent: September 21, 2004
    Assignee: Cheng Loong Corporation
    Inventors: Hsin Chung Lu, Chio Hao Hsu, I Chiao Lin, Chien Lung Weng
  • Patent number: 6619049
    Abstract: A method for manufacturing a temperature-maintaing material includes the steps of (1) selecting a phase-change substance, (2) processing the phase-change substance to form a liquid, (3) processing the phase-change substance with high molecule material to form microcapsules, (4) drying the microcapsules, (5) mixing the microcapsules with adhesive and hardening agent to form a mixture and (6) melting, cooling down and pulverizing the mixture for further processing to form a coating on an object or a substrate.
    Type: Grant
    Filed: August 12, 2002
    Date of Patent: September 16, 2003
    Assignee: Cheng Loong Corporation
    Inventor: Chieh-Jen Wu
  • Patent number: 6079337
    Abstract: A supporting structure, comprises a first plate including a rectangular upper surface and two side walls bridged along the lengthwise sides of the upper surface with folded line therebetween and vertical to the upper surface, the first plate having two first embedding slots parallel to the shorter sides thereof and extending over the side wall, and a second plate including a rectangular bottom surface and two side walls bridged along the lengthwise sides of the bottom surface with folded line therebetween and vertical to the bottom surface, the second plate having two second embedding slots parallel to the shorter sides thereof and extending over the side wall; a through hole being provided between the second embedding slots connected with the second embedding slots.
    Type: Grant
    Filed: May 6, 1999
    Date of Patent: June 27, 2000
    Assignee: Cheng Loong Corporation
    Inventors: Danis Huang, Philip Chaw
  • Patent number: 5784971
    Abstract: An improved collapsible pallet assembly structure is provided. The collapsible pallet assembly includes at least a pair of lengthwise beam members and at least a pair of crosswise beam members formed of a corrugated paper material. Each lengthwise beam member includes a surface plate portion from which a plurality of folded sidewall portions extend downward and at least one wing piece portion projects in substantially coplanar manner. The surface plate portion has formed therethrough a plurality of upper slot holes which communicate respectively with a plurality of lower slot holes formed through the sidewall portions. Each crosswise beam member includes a top plate portion from which a plurality of folded bracket plate portions extend downward. Each bracket plate portion includes a slotted opening that delineates a pair of bracket plate extending sections.
    Type: Grant
    Filed: May 21, 1997
    Date of Patent: July 28, 1998
    Assignee: Cheng Loong Corporation
    Inventor: Wen-Tsung Chang